With wise phones, automotive techniques, health care gear, industrial management, the quick advancement in the Internet of Items, sensors obtained from the government attaches terrific significance to the entire business. Broad marketplace prospective customers driven by China's domestic sensors extreme growth in the amount of suppliers, the technical level but uneven. 2012 China manufacturers sensor analysis into Chinese sensor market place and technical needs, together with mainstream supplier of sensor technology, and access to 4 core exploration findings, we hope that these findings could allow Chinese core electronic techniques producers Sensor Provide Chain There is a in depth and authoritative ecological awareness.
October thirty, 2012, Shanghai "2012 China market place leading manufacturers of sensors report" in 2012 China (Shanghai) Electronics Display grand release. The survey is a vital Chinese electronics industry's annual marketplace survey, organized by the CNT Networks, China Outlook Consulting provides experienced analysis approaches and information evaluation, made to support machine manufacturers to accurately realize the breakdown on the sensor market and recommend many high-quality Chinese sensor suppliers and sensor applications small business.
Consumer encounter, industrial management and automotive electronics industry may be the fast improvement of electrical power sensors. The net of Points is surely an emerging industry and cross-sensor sensor industry demand electrical power. According on the Ministry's forecast, China IOT market place in 2015 will exceed 500 billion yuan, in 2020 when mature will start out 1 trillion yuan degree of industry dimension, the following five years the average yearly compound development price will reach 30%. MIIT official release with the "" second 5 "development strategy of things" made it clear that by 2015 China finished the preliminary build industrial program, to kind a much more total industrial chain of factors, and also to create "intelligent marketplace, agriculture, logistics, transportation, power, environmental safety, protection, health and fitness, home, "nine big regions of target demonstration venture.
Sensors are the core with the core of items, Chinese community sensor suppliers in significant quantities, speedy growth, but the degree is uneven. In conjunction with this market atmosphere, CNT Networks strategic cooperation with China Outlook Consulting, preparing and organizing the 2012 China industry top sensor suppliers investigation activities, and accessibility to 4 core investigation discovered that:
Sensor polarization percentage of imported solutions;
European and American popular sensor supplier s;
Quality, price tag and delivery difficulties led to downgrading of qualified suppliers;
Production capacity, and various very good different supplier romantic relationship is excellent level.
The survey observed the percentage of imported goods sourcing sensors show polarization percentage of imported items a lot more than 80% plus a highest of 20% of your situations, there are thirty.5% in the total sensor suppliers imported goods much more than 80%, 19.5% corporations to import goods at 20% or much less.
65.9% on the machine producers want to get by way of direct suppliers sensors. In all sensors product or service acquire channel, sensor suppliers popular in Europe and America, fifty five.7% of firms like sensor suppliers from Europe plus the Usa for procurement, much more than other suppliers and distribution channels. In 2nd area is definitely the community sensor suppliers willing to invest in local sensor supplier sensors enterprises reached 25.1%
The first issue in vendor assortment, good quality irreconcilable, value / engineering is very essential: the products high quality is affected to start with the main component in supplier choice; beneath the premise of excellent, cost-effective solutions, primary technologies and technical assistance are critical concerns element. The excellent issues, charges, longer delivery time will force the machine manufacturer to change suppliers. Given that top quality may be the principal factor in vendor inspection, high quality issues come up naturally become top supplier downgraded the main component. Uncompetitive rates, longer delivery time and service suppliers also contributed to dissatisfaction downgrade a vital aspect.
From the supplier variety and management trade-offs in production capability, and various excellent option supplier connection is fantastic level. Supplier top quality and delivery are nonetheless puzzled Purchasing Engineer situation. Demand forecasts aren't permitted to buy more than the past year the biggest possibility. On top of that, buy defective fakes, product or service top quality difficulties, and supplier capability constraints are unable to provide the main supply of procurement threat. To reduce the chance of procurement, machine producers to adopt a in depth response, which is the most vital in 3 techniques: choose good supplier of manufacturing sources to seek out option supplies, strengthening supplier relationships.
"In a considerable variety of suppliers sensors, speedy advancement, the uneven degree of current state, China electronic methods manufacturers sensor supply chain needs to have a in depth ecological awareness and authority to adopt for his or her personal supply relationship management and evaluation Approach The survey routines are mainly selected quite possibly the most broadly applied about the market place now, by far the most well-liked from the eight classes sensor as the analysis object, we believe, "2012 China industry foremost companies of sensors report" which reveals the experience and discipline to assist the entire Machine producers accurately realize the breakdown of your sensor industry, improve procurement efficiency, procurement chance aversion, effective supplier selection and evaluation with the sensor. "survey organizers CNT Networks CEO Dr. Liu Jie (Dr. Michael Liu) representation.
The sensor 8 classes covered by the survey are: optical sensor (solar cell), the ambient light and proximity sensor, a gyro sensor, a strain sensor, accelerometer sensor, a temperature sensor, a microphone sensor, and picture sensors.
CNT Networks analyst also especially with the electronics suppliers of qualified procurement employees interviews, the survey gives a impressive case scientific studies. During the report the conference, CNT Networks Written content Operations Director Chen Lu, entitled "2012 Annual China sensor market place survey uncovered that" the keynote speech, sharing the core survey identified.
"The investigation lasted extra than one particular month, 531 valid questionnaires have been screened, the survey sensor applications associated electronic techniques manufacturer supplier certification manager, technical manager, purchasing manager, supply chain management and corporation executives, and suppliers and distributor of market, technologies and small business executives. "
2013年6月3日星期一
2013年5月21日星期二
Several Error Factors that Affect the Performance of Pressure Sensor
Total error in the analysis of the pressure sensor, we must first consider the source of an error analysis of the factors that lead to these errors, and then think of ways to reduce these errors, improve the overall performance of the sensor. This article lists the sources of error which affect the pressure sensor performance?
The total error of the pressure sensor, you should use the following definitions of error. Decision you have selected the extent of the pressure sensor-specific error, see this directory specification of the sensor.
In a particular user application, some nominal indicators can be reduced or eliminated, for example, if a pressure sensor is used in the inner half of the predetermined temperature range, then the temperature error can be reduced by half, if the use of the auto-zero techniques, zero offset, and zero drift error can be eliminated.
The zero offset is the same pressure on both sides of the diaphragm of the sensor output.
Span is the algebraic difference between the output endpoint. Usually two endpoints zero and full scale.
The zero point temperature drift is caused by temperature changes of the pressure sensor zero change. Zero offset error is not predictable, because each device can be offset upward or downward change in temperature will cause the entire output curve along the voltage axis offset up or down.
Sensitivity temperature offset is the pressure sensor sensitivity variation caused by temperature changes, temperature changes will cause the change of the slope of the sensor output curve.
The linearity error is at the desired pressure range of the sensor output curve and a deviation of the calibration straight line, a method for computing linear error is the least-squares on the straight line of best fit of the data points from mathematical.
Another method is the the end BP linearity (TBL) or endpoint linearity. TBL decision by a straight line drawn between the data points of the second end (L1) in the output curve. Subsequently a vertical line to the output curve from the line L1, and select the intersecting data points in order to achieve the maximum length of a perpendicular line, the length of the perpendicular line represents the end of BP linearity error.
Repeatability error in the other conditions remain constant, continuous together with any given input pressure deviation in output readings.
Hysteresis error is usually expressed as the mechanical hysteresis and temperature hysteresis combination of error.
The mechanical hysteresis: refers to the output sensor error in one to a given input pressure (increased, decreased different process).
Temperature hysteresis in a temperature cycle before and after the output in the exact input pressure deviation.
The ratio of the amount of change is in the other conditions remain constant sensor output ratio of the power supply voltage, the ratio of the change in error is the change in this ratio, usually expressed as a percentile of the range of the pressure sensor.
Each pressure sensor error sources sum up the above so many, some systematic errors, some random errors, some errors can be eliminated, to find a way to be eliminated through improved technologies, to ensure that the sensor has good output.
Related articles:
Temperature Sensor Monitoring the Temperature of The Belt Conveyor
The total error of the pressure sensor, you should use the following definitions of error. Decision you have selected the extent of the pressure sensor-specific error, see this directory specification of the sensor.
In a particular user application, some nominal indicators can be reduced or eliminated, for example, if a pressure sensor is used in the inner half of the predetermined temperature range, then the temperature error can be reduced by half, if the use of the auto-zero techniques, zero offset, and zero drift error can be eliminated.
The zero offset is the same pressure on both sides of the diaphragm of the sensor output.
Span is the algebraic difference between the output endpoint. Usually two endpoints zero and full scale.
The zero point temperature drift is caused by temperature changes of the pressure sensor zero change. Zero offset error is not predictable, because each device can be offset upward or downward change in temperature will cause the entire output curve along the voltage axis offset up or down.
Sensitivity temperature offset is the pressure sensor sensitivity variation caused by temperature changes, temperature changes will cause the change of the slope of the sensor output curve.
The linearity error is at the desired pressure range of the sensor output curve and a deviation of the calibration straight line, a method for computing linear error is the least-squares on the straight line of best fit of the data points from mathematical.
Another method is the the end BP linearity (TBL) or endpoint linearity. TBL decision by a straight line drawn between the data points of the second end (L1) in the output curve. Subsequently a vertical line to the output curve from the line L1, and select the intersecting data points in order to achieve the maximum length of a perpendicular line, the length of the perpendicular line represents the end of BP linearity error.
Repeatability error in the other conditions remain constant, continuous together with any given input pressure deviation in output readings.
Hysteresis error is usually expressed as the mechanical hysteresis and temperature hysteresis combination of error.
The mechanical hysteresis: refers to the output sensor error in one to a given input pressure (increased, decreased different process).
Temperature hysteresis in a temperature cycle before and after the output in the exact input pressure deviation.
The ratio of the amount of change is in the other conditions remain constant sensor output ratio of the power supply voltage, the ratio of the change in error is the change in this ratio, usually expressed as a percentile of the range of the pressure sensor.
Each pressure sensor error sources sum up the above so many, some systematic errors, some random errors, some errors can be eliminated, to find a way to be eliminated through improved technologies, to ensure that the sensor has good output.
Related articles:
Temperature Sensor Monitoring the Temperature of The Belt Conveyor
2013年5月8日星期三
Comprehensive Understanding of Touch Phone Touch Screen
The first mobile phone was born in 1973 in the United States, Martin Cooper invented by Motorola's engineers and technicians. This mobile phone Martin Cooper also can not be called a phone, because his foot two bricks, "mobile phone" in the true sense of the launch in 1987, and since then, the volume of mobile phones more and more on technologies and applications used in mobile phones more and more rich. After 2006, the subversive phone upgrade getting smaller and smaller, but another mobile application revolution continues to spread, this is the popularity of mobile phones touch operation.
2008 to 2009 the global touch phone flourishing moment the mainstream touch interface has more than nine kinds of these innovative designs are receiving the baptism of the market. After the selection of the Ebb Tide, and ultimately the strong win, now is the time we can see the whole market overview. China Mobile launched special large-scale thematic interpretation of the mainstream mobile phone touch operation platform.
First, capacitive touch screen with resistive touch screen
1. capacitive touch screen introduction:
The four sides of the touch screen, capacitive touch screen plated with a narrow electrode, a low-voltage alternating electric field is formed in the conductive body. The touch screen, the body farm, fingers conductor layer will form a coupling capacitor, issued by the four sides of the electrode current will flow to the contact, and the current strength of the finger to the electrode is proportional to the distance, touch screen controller calculates the ratio of the currents and strong or weak, to accurately calculate the position of the touch point.
The capacitive touch screen is a special metal layer of transparent conductive material in the surface of the glass paste. When the finger touch on the metal layer, the capacitance of the contacts occurs, such that the associated oscillator frequency is changed, the change can be determined by measuring the frequency of the touch position obtained information.
Capacitive touch screen defects:
Varies due to the capacitance change with temperature, humidity or ground to different circumstances and therefore its stability is poor, and tends to produce a drift phenomenon. The touch screen is suitable for the commissioning phase of the system development.
2. resistive touch screen basic principles:
The use of pressure-sensitive resistive touch screen control. A main part of the resistive touch screen resistive films screen is a very complex piece with the display surface, which is a multi-layered composite film as primary layer of glass or hard plastic plate, the surface coated with a layer of transparent metal oxide (transparent conductive resistance) of the conductive layer, above and then cover with a layer of outer surface hardening treatment, smooth plastic layer anti-rub, and its inner surface is also coated with a layer of coating, between them, have many of the small (less than 1/1000 inch) transparent The isolation point the two conductive layers separated by insulation. When the finger touches the screen, the two conductive layers on the touch point there will be a contact resistance change signal is generated on the X and Y directions, and then send the touch screen controller. The controller detects the contact and to calculate the position (X, Y), according to the operation of the simulated mouse. This is the basic principle of the resistive touch screen technology.
Second, the resolution
1. Screen resolution:
The screen resolution is to determine how much information settings displayed on the screen, to measure the horizontal and vertical pixels. The screen resolution is low (for example, 640 x 480), the items displayed on the screen, but the relatively large size. Screen resolution (example 1600 x 1200), the items displayed on the screen, but the size is relatively small.
2. Definition of WVGA:
Digital products a screen material the VGA of another form than the VGA resolution, alias: Wide VGA resolution of 800 x 480 pixels. To expand the resolution of VGA (640 x 480). Used in PDA and cell phones, because a lot of the width of the page is 800 WVGA screen will be more appropriate and in browsing the web, it can be said the resolution trend of handheld devices in the future.
3. Definition of QVGA:
The QVGA QuarterVGA "refers to one of the VGA size. Is output on the LCD screen resolution is 240 x 320 pixels. It should be noted that some of the media as a QVGA screen with TFT and TFD LCD material is the same thing wrong the QVGA screen saying common with some of Japan's mobile phone power supply, Microsoft PPC operating system for smart phones screen mostly 320 x 240 pixel QVGA screen.
The so-called the QVGA LCD technology, is output on the LCD screen resolution is 240 x 320 LCD output mode. In fact, this resolution does not matter the size of the screen itself. For example, if the 2.1-inch LCD display screen can display 240 x 320 resolution image, it is called "QVGA 2.1-inch LCD screen; 3.8-inch LCD screen can display 240 x 320 image, called" QVGA 3.8-inch liquid crystal display ", although both of these cases have the same resolution, but due to the size of the type of the actual visual effect type, generally small screen of a screen will naturally small.
2008 to 2009 the global touch phone flourishing moment the mainstream touch interface has more than nine kinds of these innovative designs are receiving the baptism of the market. After the selection of the Ebb Tide, and ultimately the strong win, now is the time we can see the whole market overview. China Mobile launched special large-scale thematic interpretation of the mainstream mobile phone touch operation platform.
First, capacitive touch screen with resistive touch screen
1. capacitive touch screen introduction:
The four sides of the touch screen, capacitive touch screen plated with a narrow electrode, a low-voltage alternating electric field is formed in the conductive body. The touch screen, the body farm, fingers conductor layer will form a coupling capacitor, issued by the four sides of the electrode current will flow to the contact, and the current strength of the finger to the electrode is proportional to the distance, touch screen controller calculates the ratio of the currents and strong or weak, to accurately calculate the position of the touch point.
The capacitive touch screen is a special metal layer of transparent conductive material in the surface of the glass paste. When the finger touch on the metal layer, the capacitance of the contacts occurs, such that the associated oscillator frequency is changed, the change can be determined by measuring the frequency of the touch position obtained information.
Capacitive touch screen defects:
Varies due to the capacitance change with temperature, humidity or ground to different circumstances and therefore its stability is poor, and tends to produce a drift phenomenon. The touch screen is suitable for the commissioning phase of the system development.
2. resistive touch screen basic principles:
The use of pressure-sensitive resistive touch screen control. A main part of the resistive touch screen resistive films screen is a very complex piece with the display surface, which is a multi-layered composite film as primary layer of glass or hard plastic plate, the surface coated with a layer of transparent metal oxide (transparent conductive resistance) of the conductive layer, above and then cover with a layer of outer surface hardening treatment, smooth plastic layer anti-rub, and its inner surface is also coated with a layer of coating, between them, have many of the small (less than 1/1000 inch) transparent The isolation point the two conductive layers separated by insulation. When the finger touches the screen, the two conductive layers on the touch point there will be a contact resistance change signal is generated on the X and Y directions, and then send the touch screen controller. The controller detects the contact and to calculate the position (X, Y), according to the operation of the simulated mouse. This is the basic principle of the resistive touch screen technology.
Second, the resolution
1. Screen resolution:
The screen resolution is to determine how much information settings displayed on the screen, to measure the horizontal and vertical pixels. The screen resolution is low (for example, 640 x 480), the items displayed on the screen, but the relatively large size. Screen resolution (example 1600 x 1200), the items displayed on the screen, but the size is relatively small.
2. Definition of WVGA:
Digital products a screen material the VGA of another form than the VGA resolution, alias: Wide VGA resolution of 800 x 480 pixels. To expand the resolution of VGA (640 x 480). Used in PDA and cell phones, because a lot of the width of the page is 800 WVGA screen will be more appropriate and in browsing the web, it can be said the resolution trend of handheld devices in the future.
3. Definition of QVGA:
The QVGA QuarterVGA "refers to one of the VGA size. Is output on the LCD screen resolution is 240 x 320 pixels. It should be noted that some of the media as a QVGA screen with TFT and TFD LCD material is the same thing wrong the QVGA screen saying common with some of Japan's mobile phone power supply, Microsoft PPC operating system for smart phones screen mostly 320 x 240 pixel QVGA screen.
The so-called the QVGA LCD technology, is output on the LCD screen resolution is 240 x 320 LCD output mode. In fact, this resolution does not matter the size of the screen itself. For example, if the 2.1-inch LCD display screen can display 240 x 320 resolution image, it is called "QVGA 2.1-inch LCD screen; 3.8-inch LCD screen can display 240 x 320 image, called" QVGA 3.8-inch liquid crystal display ", although both of these cases have the same resolution, but due to the size of the type of the actual visual effect type, generally small screen of a screen will naturally small.
2013年4月24日星期三
"Smart" Lithium Battery, Leading the Trend of Electric Car Industry
December 19 Jie Obi electric car Co., Ltd. was held in Hangzhou New Kaiyuan Hotel 2013 Jie Obi lithium car new conference and annual meeting in Zhejiang Province. Meeting Geoby CEO Mr. Wang Shuguang announced the launch of high-energy lithium battery, super lithium and smart motorcycle models of a variety of industry-leading technology. Jie Obi electric cars Hangzhou first flagship store officially opened on December 8, 2012 (address: Hangzhou, Zhejiang Province, Zhongshan Road No. 343) stores an area of 800 square meters, has attracted wide attention.
Lithium trend, the market is huge
In recent years, energy saving and environmental protection is the development direction of the electric bicycle, participating Zhejiang Bicycle Electric Vehicle Industry Association executive vice chairman and secretary general Mr. Chen Jianlong when it comes to the electric car industry trends, as technology advances, lithium battery electric The bike is expected to replace the current lead-acid battery electric bicycle. The higher the penetration rate of the lithium battery electric vehicles in Europe and the United States and other developed countries, the market share above 50%, China's lithium car industry is still in its infancy, the market has great potential.
As the the domestic lithium car brand Geoby, has been great importance to the development and marketing of lithium-ion technology models. The launch of the high-energy, super and smart products with advanced technology, the industry leader. Jie Obi sales staff introduced lightweight lithium battery, environmental protection, waste will not cause environmental pollution, the current Jie Obi application technology is mature, market sales growth.
"Three energy products, advanced technology
Jie Obi at the press conference launch of the high-energy, super new products and smart lithium, with quiet, powerful, technologically advanced, full of bright spots. In smart motorcyclists products, the entire department is equipped with intelligent power / transmission system makes riding easier, equipped with the excellent quality 24V/6.6AH lithium battery power, 200W brushless high-speed dc motor, perfect. It is noteworthy that Yi moving Yat-induced high-end models, taking into account the consumer driving experience, especially equipped with a sine wave mute control system, to reflect the Geoby high-end and taste. Super lithium models, "JETMASTER - climbing Wang equipped with the 250W/350W aluminum high-speed brushless motor, 48V/10Ah large-capacity lithium battery, can be described as the" T "of electric vehicles power, powerful, longer battery life mileage. High-energy lithium models to go young beautiful route, simple and beautiful, the same eye-catching, and very cost-effective. In addition, it is learned Jie Obi lithium car battery reliable and trouble-free "Sony" high-quality batteries, state-of-the-art technology, to provide a guarantee.
Support lithium battery, and develop the market
At the meeting, the Czech Republic, Obi also introduced policies to foster the development of lithium car market. Zhejiang sales center responsible for ordering policy announced by Mr. Huang Ji, encourage dealers to conduct market development, to nurture potential market, the company will give dealers strong support professional management and incentives, more power lithium-powered products promotion.
According to the Czech Republic battery manufacturer, Obi CEO Mr. Wang Shuguang, the Reko than lithium-powered products in the country's population has more than 200,000 Jie Obi high-energy lithium, lithium Super Intelligent Lithium full range, is currently the country's most complete series products. Next, the Czech Republic, Obi will further strengthen the in lithium car industry input, to support industrial development to achieve a win-win situation for business and society.
Lithium trend, the market is huge
In recent years, energy saving and environmental protection is the development direction of the electric bicycle, participating Zhejiang Bicycle Electric Vehicle Industry Association executive vice chairman and secretary general Mr. Chen Jianlong when it comes to the electric car industry trends, as technology advances, lithium battery electric The bike is expected to replace the current lead-acid battery electric bicycle. The higher the penetration rate of the lithium battery electric vehicles in Europe and the United States and other developed countries, the market share above 50%, China's lithium car industry is still in its infancy, the market has great potential.
As the the domestic lithium car brand Geoby, has been great importance to the development and marketing of lithium-ion technology models. The launch of the high-energy, super and smart products with advanced technology, the industry leader. Jie Obi sales staff introduced lightweight lithium battery, environmental protection, waste will not cause environmental pollution, the current Jie Obi application technology is mature, market sales growth.
"Three energy products, advanced technology
Jie Obi at the press conference launch of the high-energy, super new products and smart lithium, with quiet, powerful, technologically advanced, full of bright spots. In smart motorcyclists products, the entire department is equipped with intelligent power / transmission system makes riding easier, equipped with the excellent quality 24V/6.6AH lithium battery power, 200W brushless high-speed dc motor, perfect. It is noteworthy that Yi moving Yat-induced high-end models, taking into account the consumer driving experience, especially equipped with a sine wave mute control system, to reflect the Geoby high-end and taste. Super lithium models, "JETMASTER - climbing Wang equipped with the 250W/350W aluminum high-speed brushless motor, 48V/10Ah large-capacity lithium battery, can be described as the" T "of electric vehicles power, powerful, longer battery life mileage. High-energy lithium models to go young beautiful route, simple and beautiful, the same eye-catching, and very cost-effective. In addition, it is learned Jie Obi lithium car battery reliable and trouble-free "Sony" high-quality batteries, state-of-the-art technology, to provide a guarantee.
Support lithium battery, and develop the market
At the meeting, the Czech Republic, Obi also introduced policies to foster the development of lithium car market. Zhejiang sales center responsible for ordering policy announced by Mr. Huang Ji, encourage dealers to conduct market development, to nurture potential market, the company will give dealers strong support professional management and incentives, more power lithium-powered products promotion.
According to the Czech Republic battery manufacturer, Obi CEO Mr. Wang Shuguang, the Reko than lithium-powered products in the country's population has more than 200,000 Jie Obi high-energy lithium, lithium Super Intelligent Lithium full range, is currently the country's most complete series products. Next, the Czech Republic, Obi will further strengthen the in lithium car industry input, to support industrial development to achieve a win-win situation for business and society.
2013年4月15日星期一
Price and Development Experience Hinder the Mainland Manufacturers to Use Capacitive Touch Screen
Although capacitive touch screen mobile phone manufacturers around the world concern and by increasing the other hand, mainland China brand mobile phone manufacturers, has long been focused on the faster development progress, timing and price of production, for capacitive touch screen Followers more butcapacitive touchscreen of real gross domestic brand market share is less than 3%, compared to the general international brands is currently about 20% is much lower.
Capacitive touch screen module price is about 1.4 to 2.5 times the flat screen resistive touch screen, depending on the material structure differ. Mainland China brand mobile phone prices 20 to 50% lower compared with the general international brand mobile phone prices, most manufacturers want to wait for the experience of other touch screen manufacturers to adopt as a reference. Personally, I think the prices and the use and development of capacitive touch screen experience is still the main factors to affect the capacitive touch screen Chinese mainland market penetration.
Resistive touch screen, traditional resistive touch-screen technology threshold is low, the technology is mature market, an adequate supply of relatively lower prices, so it is still the main choice of touch screen mobile phone market. In addition to the traditional analog linear resistive 4-wire resistive screen, is already related to the development of a the modified resistive touch screen, known as analog the matrix touch (AMR) can support multi-touch and gesture recognition next generation touch technology needs.
However, the relatively weak resistive touch ITO film will reduce the panel transmittance, and resistive touch sensor requires a larger finger poke force when operating the touch, capacitive touch of a finger sensor, the resistive must hand pointed out that a larger force before induction, and finger contact with the film texture glass panel with a capacitive touch screen majority can not be compared.
Therefore, capacitive touch screen instrument high light transmittance, high durability, long service life, good touch-sensitive, multi-touch and superior performance, and many other advantages, gradually gained popularity in the mobile phone, predictable capacity with high performance capacitive touch screen panel domestic the phone will be increased. Capacitive touch screen development time is short, its future growth is still much room.
Capacitive touch screen module price is about 1.4 to 2.5 times the flat screen resistive touch screen, depending on the material structure differ. Mainland China brand mobile phone prices 20 to 50% lower compared with the general international brand mobile phone prices, most manufacturers want to wait for the experience of other touch screen manufacturers to adopt as a reference. Personally, I think the prices and the use and development of capacitive touch screen experience is still the main factors to affect the capacitive touch screen Chinese mainland market penetration.
Resistive touch screen, traditional resistive touch-screen technology threshold is low, the technology is mature market, an adequate supply of relatively lower prices, so it is still the main choice of touch screen mobile phone market. In addition to the traditional analog linear resistive 4-wire resistive screen, is already related to the development of a the modified resistive touch screen, known as analog the matrix touch (AMR) can support multi-touch and gesture recognition next generation touch technology needs.
However, the relatively weak resistive touch ITO film will reduce the panel transmittance, and resistive touch sensor requires a larger finger poke force when operating the touch, capacitive touch of a finger sensor, the resistive must hand pointed out that a larger force before induction, and finger contact with the film texture glass panel with a capacitive touch screen majority can not be compared.
Therefore, capacitive touch screen instrument high light transmittance, high durability, long service life, good touch-sensitive, multi-touch and superior performance, and many other advantages, gradually gained popularity in the mobile phone, predictable capacity with high performance capacitive touch screen panel domestic the phone will be increased. Capacitive touch screen development time is short, its future growth is still much room.
2013年3月26日星期二
Fudan University Professor Developed a New Type of Lithium Battery
A "natural" magazine sub s "science reporting" (Sci.Report) published a heavy research Fudan University, Professor Wu Yuping Task Force. The latest research on an aqueous solution of lithium battery systems, lithium battery performance by 80%. Electric car charging only need 10 seconds to travel 400 kilometers, this battery cost, security is not easy explosion.
Wu Yuping research group showed reporters on the 13th of this lithium battery system. A thin layer of metallic lithium, a special composite membrane tightly wrapped, to be placed in the pH value was in the neutral aqueous solution, an average, can be made with the traditional cathode materials in lithium ion battery spinel manganate lithium assembly charging voltage of 4.2V, the discharge voltage of 4.0V new water lithium battery, this result greatly exceeded the aqueous solution of the theoretical decomposition voltage 1.23V.
According to reports, the commonly used organic electrolyte lithium-ion battery. The large energy storage system, the traditional high cost of lithium batteries, the high requirements on the production conditions, and because the physical and chemical properties of the organic electrolyte, there is greater safety hazards. This is the new energy products such power car is not the main obstacle to large-scale promotion.
Wu Yuping Task Force of the achievements on the development of a new low-cost, easy to mass production, possible safety environmental protection battery system. Allegedly, the novel water lithium using the aqueous solution as electrolyte, a flame retardant enhanced, so that the battery during use less hot fever, high safety performance; composite film made of a polymer material and an inorganic material, capable of the energy loss of the battery below 5%.
It is estimated that if this battery for mobile phones, the battery supplier of the same size at least be able to extend the phone talk time doubled, the cost is less than half of the original; same used in automotive pollution on the environment than existing lithium The battery is much smaller.
Wu Yuping said U.S. Energy Research Institute "aiming" in the study, and his hope to reach a cooperation intention. He also hoped that a forward-looking enterprise cooperation with the country. He said, "novel aqueous lithium in life can be specifically applied to on all sides, I hope the water lithium breakthrough to end, the consumers of safe, accepted on costs, the solution to the current global faltering electric car industry .
Wu Yuping research group showed reporters on the 13th of this lithium battery system. A thin layer of metallic lithium, a special composite membrane tightly wrapped, to be placed in the pH value was in the neutral aqueous solution, an average, can be made with the traditional cathode materials in lithium ion battery spinel manganate lithium assembly charging voltage of 4.2V, the discharge voltage of 4.0V new water lithium battery, this result greatly exceeded the aqueous solution of the theoretical decomposition voltage 1.23V.
According to reports, the commonly used organic electrolyte lithium-ion battery. The large energy storage system, the traditional high cost of lithium batteries, the high requirements on the production conditions, and because the physical and chemical properties of the organic electrolyte, there is greater safety hazards. This is the new energy products such power car is not the main obstacle to large-scale promotion.
Wu Yuping Task Force of the achievements on the development of a new low-cost, easy to mass production, possible safety environmental protection battery system. Allegedly, the novel water lithium using the aqueous solution as electrolyte, a flame retardant enhanced, so that the battery during use less hot fever, high safety performance; composite film made of a polymer material and an inorganic material, capable of the energy loss of the battery below 5%.
It is estimated that if this battery for mobile phones, the battery supplier of the same size at least be able to extend the phone talk time doubled, the cost is less than half of the original; same used in automotive pollution on the environment than existing lithium The battery is much smaller.
Wu Yuping said U.S. Energy Research Institute "aiming" in the study, and his hope to reach a cooperation intention. He also hoped that a forward-looking enterprise cooperation with the country. He said, "novel aqueous lithium in life can be specifically applied to on all sides, I hope the water lithium breakthrough to end, the consumers of safe, accepted on costs, the solution to the current global faltering electric car industry .
2013年3月20日星期三
Competition in Car Lithium Battery Development
Rechargeable battery is largely about the environmental performance of electric vehicles and vehicle costs. Car rechargeable batteries not only need to meet the energy capacity of the vehicle farther from the decision, the instantaneous current input and output, as well as to prevent abnormal heat and fire safety requirements, and also need to meet in order to make electric cars that can be accepted by ordinary consumers, cost requirements, being the fierce competition in the development for enterprises. The development of the lithium-ion rechargeable batteries in the future will focus on the following three elements: (1) reduce the cost of energy per unit of capacity; (2) to ensure security; (3) inhibition of charging and discharging a result of deterioration. Especially inhibiting the deterioration of charge and discharge causes, relationship to the user the feeling of use of electric vehicles, and contains the total cost of the maintenance costs, including, therefore important factor can not be ignored.
The Cathode Material choices vary
The performance and cost of the battery depends on the material, structure, and control, of which the most important is the choice of materials. Battery manufacturers must make the optimal choice from a variety of candidate materials. Are already in production or plan the next 1 to 2 years of mass production of lithium-ion rechargeable battery cathode material, in accordance with the different material combinations with lithium, divided into four kinds the ternary manganese, NCA and iron phosphate class (Figure 1). Cathode materials are generally of the conventional lithium battery using lithium cobalt oxide (LiCoO2). But the use of a positive electrode of lithium cobaltate when charging the crystal structure is not stable enough to use in the vehicle-mounted battery, the existence of the security issue. Develop in-vehicle lithium battery technology to try and develop a new material instead of lithium cobalt oxide.
Be referred to as a ternary material of lithium cobalt oxide part of the cobalt, nickel and manganese is substituted by cobalt, nickel, manganese, three components, to improve the stability of the material. Ternary [Li (Ni-Mn-Co) O2] battery materials manufacturers including the announcement of the shallow the Suzuki extended-range electric vehicle supply lithium batteries, Sanyo Electric, and developed for Honda PHEV supply battery GS soup with Honda joint venture company Blue Energy Japan.
The NCA based material NCA is nickel, cobalt, aluminum, three word prefix abbreviation. NCA class of materials made of aluminum instead of manganese ternary material. NCA class material [Li (Ni-Co-Al) O2] is the joint venture of Toyota and Panasonic Primearth EV Energy with its production of lithium battery is equipped in the Prius plug-in hybrid. NCA class lithium generally has excellent energy density, but there are still to be solved in terms of safety. Primearth EV Energy Company in order to improve the lithium-ion rechargeable battery security, improve the heat resistance of coated ceramic layer on the negative measures, so as to strengthen the safety performance.
The manganese-based material using lithium manganese oxide (LiMn2O4). Such materials have been widely adopted by the battery manufacturers in Japan, South Korea and the United States is now the mainstream car battery. Major manufacturers including Automotive Energy Supply to supply batteries Nissan LEAF (Chinese name: hear the wind) for the the Mitsubishi iMiEV supply battery Lithium Energy Japan, LG Chem to supply batteries for GM's Volt, as well as Daimler, BMW and Beijing Automotive supply batteries, Johnson Controls-Saft (Johnson Controls-Saft), etc.. The manganese-based material compared with the ternary and NCA based material, in theory, the energy capacity density is lower, but the lithium atoms, manganese atoms, and an oxygen atom capable of forming a solid crystal structure, and therefore thermal stability is excellent, safe. In addition, manganese, cobalt and nickel, compared the prices of raw materials cheaper cost advantage. The prices of raw materials in descending order of the cobalt, nickel, manganese, if the price of cobalt is seen as 10 words, then nickel is 5, and manganese is less than 1.
The material of ferrous phosphate (LiFePO4) cathode materials for Chinese manufacturers to use more. Such material tightly due to phosphorus (P) and oxygen (O), even when the battery internal heat, the crystal structure also difficult destruction is therefore highly safe. Ago due to low electrical conductivity of the iron phosphate-based material, there is a problem, but difficult to improve the output power supply in the cathode material coated fine CFC improved characteristics, greatly promote the process of practical. The advantage of such materials in addition to the safety, another advantage in that the cost of materials. Raw material prices of iron manganese also cheap, estimated about only manganese fraction of. But there are also technical personnel noted that the process for manufacturing of such material are high cost, so it is difficult to play out the cost advantages of the material itself. Due to the need to create prevent iron oxidation manufacturing environment, but also for the cathode material coated with carbon quality management process also takes manpower and resources, and therefore contain manufacturing costs, including the total cost is not necessarily cheaper.
Cost target is 20,000 yen / kWh reduced consumer products with lithium batteries quite
Currently, the Japanese manufacturer of car lithium battery costs about 10 to 12 million yen / kWh, Chinese manufacturers for its half. GM's Volt battery costs 100,000 yen / kWh to calculate the cost of electric car battery with 16kwh battery for 1.6 million yen, The Nissan LEAF with 24kwh battery for 2.4 million yen (Figure 2). Only the cost of the battery is equivalent to the price of a car. In other words, EV and REV (modified EV) compared with the same level of gasoline cars, the cost will be twice as high. To promote the popularization of electric vehicles, battery costs must be reduced.
Car lithium battery cost targets consumer products is reduced to the level of lithium batteries. Consumer products with lithium batteries cost about 20,000 yen / kWh. 20,000 yen / kWh, the Volt's battery costs 320,000 yen, LEAF 480,000 yen. Battery costs can be reduced by 1.28 million yen and 1.92 million yen. The cost of the battery will decrease reflected in vehicle prices, then, to the Volt price can be reduced to 2 million yen, LEAF can be reduced to 1.85 million yen. If the cost can be reduced to this level, the electric car will be able to achieve the average consumer can afford the price.
20,000 yen / kWh cost is also consistent with the target value of the Japanese and Chinese car lithium battery development blueprint. Preparation of the car in Japan's New Energy and Industrial Technology Development Organization (NEDO) rechargeable battery development blueprint, the cost target for 2015 dropped to 30,000 yen / kWh 20,000 yen / kWh in 2020 for year three. In electric vehicle technology blueprint released by the Chinese government in 2015, China's battery cost target value of $ 1,500 / kWh (about 18,000 yen) (Figure 3).
The attitude of the battery suppliers for car battery cost 20,000 yen / kWh support the possibility of this goal. Nissan joint venture between NEC executives in an interview with Reuters in September 2010, said the company is promoting the development of lithium-ion rechargeable battery, the goal is to have 2017, its price compared with the products now halved performance doubled. Half the price doubled the performance dropped to a quarter of the current means the price per kWh. Assuming the current cost of the battery for 100,000 yen / kWh, the 2017 cost is 25,000 yen / kWh. In addition, LG Chemical Company executives said in February 2011 at the International Conference on the price of the company that will be mass produced lithium-ion rechargeable battery 350 to $ 400 / kWh (about 28,000 to 32,000 yen). LG Chem said 350 to 400 U.S. dollars / kWh prices considering the cost of the company will be reduced.
A driving force to reduce the prices of the battery unit capacity is a high capacity, and improve production efficiency. High capacity, consumer products, energy density lithium nearing 250Wh/kg, the and car lithium battery is only about 100Wh/kg. Car lithium battery, there is scope to improve the energy density. Battery Unit another driving force is reduced to improve production efficiency, it may be mainly adopted to expand the scale to obtain the mass-production effect, to improve the process and reduce the cost of production equipment and other measures to achieve. Automotive Energy Supply Company regarding its future car rechargeable battery production plans, 50,000 EV battery unit available for mass production from 2011, the increase in production by 2013 will amount to 500,000 EV
The deterioration of the battery performance problems can not be ignored
Car lithium battery elements can not be ignored is the deterioration of the battery problem. Buy a new car to the scrap car to use a minimum of 10 years. If the battery obvious deterioration during this period, the user is forced to replace the batteries of electric vehicles, it will damage the user experience, the user will increase the economic burden.
The rechargeable battery using the electrochemical reaction of charge and discharge, and therefore it is inevitable to cause deterioration due to repeated use. EV users must be aware of in advance of the: EV 5 years after the deterioration of the battery may cause the battery capacity is reduced by 20 to 30%. With a capacity of 25kWh battery, can travel 150km of EV example, the battery capacity decline may lead to shorten the travel distance of 30 ~~ 50km. Perhaps the user wants the performance deterioration of the battery replaced, in this case, even if the battery is priced at 20,000 yen / kWh battery replacement costs 500,000 yen. Assume that every 5 years would cost 500,000 yen replace the battery, then the annual cost burden is 100,000 yen, the user needs to be considered in advance EV maintenance fees.
As mentioned above, the battery life is directly related to the user's EV cost of ownership, so it will become a key element in the car charging battery development. Future, widespread popularity EV and PEHV standing with costs, but also reduce the user's vehicle to the point of view of the cost of ownership and cost assessment, on-board lithium battery. Concern as a strong anti-deterioration performance car lithium battery is a the negative lithium titanate battery. The negative electrode of lithium batteries generally use graphite, but the durability can be improved using the lithium titanate. Toshiba experimental results show that the lithium titanate negative electrode of the lithium battery life when compared with the use of graphite in the traditional lithium may be extended to 6 times. In this case, you do not need during the life of the vehicle due to the deterioration of the battery and replace the battery, it will not cause the user's vehicle with rising costs. Toshiba is currently in mass production car lithium battery using lithium titanate addition to Mitsubishi Motors of this battery will be on the company's EV, Honda is also considering for the company developed the Fit EV.
The lithium-ion rechargeable battery technology is still in its development stage enterprises in order to further technological progress in the fierce competition. In the future, companies develop in-vehicle lithium battery, not only in energy capacity, cost, and security there is often a shift in the relationship between the elements of the (Trade-off) aspects to achieve optimization, but also stand the impact of performance degradation, and contains maintenance fees, including the cost of ownership perspective, comprehensive performance evaluation of the battery.
The Cathode Material choices vary
The performance and cost of the battery depends on the material, structure, and control, of which the most important is the choice of materials. Battery manufacturers must make the optimal choice from a variety of candidate materials. Are already in production or plan the next 1 to 2 years of mass production of lithium-ion rechargeable battery cathode material, in accordance with the different material combinations with lithium, divided into four kinds the ternary manganese, NCA and iron phosphate class (Figure 1). Cathode materials are generally of the conventional lithium battery using lithium cobalt oxide (LiCoO2). But the use of a positive electrode of lithium cobaltate when charging the crystal structure is not stable enough to use in the vehicle-mounted battery, the existence of the security issue. Develop in-vehicle lithium battery technology to try and develop a new material instead of lithium cobalt oxide.
Be referred to as a ternary material of lithium cobalt oxide part of the cobalt, nickel and manganese is substituted by cobalt, nickel, manganese, three components, to improve the stability of the material. Ternary [Li (Ni-Mn-Co) O2] battery materials manufacturers including the announcement of the shallow the Suzuki extended-range electric vehicle supply lithium batteries, Sanyo Electric, and developed for Honda PHEV supply battery GS soup with Honda joint venture company Blue Energy Japan.
The NCA based material NCA is nickel, cobalt, aluminum, three word prefix abbreviation. NCA class of materials made of aluminum instead of manganese ternary material. NCA class material [Li (Ni-Co-Al) O2] is the joint venture of Toyota and Panasonic Primearth EV Energy with its production of lithium battery is equipped in the Prius plug-in hybrid. NCA class lithium generally has excellent energy density, but there are still to be solved in terms of safety. Primearth EV Energy Company in order to improve the lithium-ion rechargeable battery security, improve the heat resistance of coated ceramic layer on the negative measures, so as to strengthen the safety performance.
The manganese-based material using lithium manganese oxide (LiMn2O4). Such materials have been widely adopted by the battery manufacturers in Japan, South Korea and the United States is now the mainstream car battery. Major manufacturers including Automotive Energy Supply to supply batteries Nissan LEAF (Chinese name: hear the wind) for the the Mitsubishi iMiEV supply battery Lithium Energy Japan, LG Chem to supply batteries for GM's Volt, as well as Daimler, BMW and Beijing Automotive supply batteries, Johnson Controls-Saft (Johnson Controls-Saft), etc.. The manganese-based material compared with the ternary and NCA based material, in theory, the energy capacity density is lower, but the lithium atoms, manganese atoms, and an oxygen atom capable of forming a solid crystal structure, and therefore thermal stability is excellent, safe. In addition, manganese, cobalt and nickel, compared the prices of raw materials cheaper cost advantage. The prices of raw materials in descending order of the cobalt, nickel, manganese, if the price of cobalt is seen as 10 words, then nickel is 5, and manganese is less than 1.
The material of ferrous phosphate (LiFePO4) cathode materials for Chinese manufacturers to use more. Such material tightly due to phosphorus (P) and oxygen (O), even when the battery internal heat, the crystal structure also difficult destruction is therefore highly safe. Ago due to low electrical conductivity of the iron phosphate-based material, there is a problem, but difficult to improve the output power supply in the cathode material coated fine CFC improved characteristics, greatly promote the process of practical. The advantage of such materials in addition to the safety, another advantage in that the cost of materials. Raw material prices of iron manganese also cheap, estimated about only manganese fraction of. But there are also technical personnel noted that the process for manufacturing of such material are high cost, so it is difficult to play out the cost advantages of the material itself. Due to the need to create prevent iron oxidation manufacturing environment, but also for the cathode material coated with carbon quality management process also takes manpower and resources, and therefore contain manufacturing costs, including the total cost is not necessarily cheaper.
Cost target is 20,000 yen / kWh reduced consumer products with lithium batteries quite
Currently, the Japanese manufacturer of car lithium battery costs about 10 to 12 million yen / kWh, Chinese manufacturers for its half. GM's Volt battery costs 100,000 yen / kWh to calculate the cost of electric car battery with 16kwh battery for 1.6 million yen, The Nissan LEAF with 24kwh battery for 2.4 million yen (Figure 2). Only the cost of the battery is equivalent to the price of a car. In other words, EV and REV (modified EV) compared with the same level of gasoline cars, the cost will be twice as high. To promote the popularization of electric vehicles, battery costs must be reduced.
Car lithium battery cost targets consumer products is reduced to the level of lithium batteries. Consumer products with lithium batteries cost about 20,000 yen / kWh. 20,000 yen / kWh, the Volt's battery costs 320,000 yen, LEAF 480,000 yen. Battery costs can be reduced by 1.28 million yen and 1.92 million yen. The cost of the battery will decrease reflected in vehicle prices, then, to the Volt price can be reduced to 2 million yen, LEAF can be reduced to 1.85 million yen. If the cost can be reduced to this level, the electric car will be able to achieve the average consumer can afford the price.
20,000 yen / kWh cost is also consistent with the target value of the Japanese and Chinese car lithium battery development blueprint. Preparation of the car in Japan's New Energy and Industrial Technology Development Organization (NEDO) rechargeable battery development blueprint, the cost target for 2015 dropped to 30,000 yen / kWh 20,000 yen / kWh in 2020 for year three. In electric vehicle technology blueprint released by the Chinese government in 2015, China's battery cost target value of $ 1,500 / kWh (about 18,000 yen) (Figure 3).
The attitude of the battery suppliers for car battery cost 20,000 yen / kWh support the possibility of this goal. Nissan joint venture between NEC executives in an interview with Reuters in September 2010, said the company is promoting the development of lithium-ion rechargeable battery, the goal is to have 2017, its price compared with the products now halved performance doubled. Half the price doubled the performance dropped to a quarter of the current means the price per kWh. Assuming the current cost of the battery for 100,000 yen / kWh, the 2017 cost is 25,000 yen / kWh. In addition, LG Chemical Company executives said in February 2011 at the International Conference on the price of the company that will be mass produced lithium-ion rechargeable battery 350 to $ 400 / kWh (about 28,000 to 32,000 yen). LG Chem said 350 to 400 U.S. dollars / kWh prices considering the cost of the company will be reduced.
A driving force to reduce the prices of the battery unit capacity is a high capacity, and improve production efficiency. High capacity, consumer products, energy density lithium nearing 250Wh/kg, the and car lithium battery is only about 100Wh/kg. Car lithium battery, there is scope to improve the energy density. Battery Unit another driving force is reduced to improve production efficiency, it may be mainly adopted to expand the scale to obtain the mass-production effect, to improve the process and reduce the cost of production equipment and other measures to achieve. Automotive Energy Supply Company regarding its future car rechargeable battery production plans, 50,000 EV battery unit available for mass production from 2011, the increase in production by 2013 will amount to 500,000 EV
The deterioration of the battery performance problems can not be ignored
Car lithium battery elements can not be ignored is the deterioration of the battery problem. Buy a new car to the scrap car to use a minimum of 10 years. If the battery obvious deterioration during this period, the user is forced to replace the batteries of electric vehicles, it will damage the user experience, the user will increase the economic burden.
The rechargeable battery using the electrochemical reaction of charge and discharge, and therefore it is inevitable to cause deterioration due to repeated use. EV users must be aware of in advance of the: EV 5 years after the deterioration of the battery may cause the battery capacity is reduced by 20 to 30%. With a capacity of 25kWh battery, can travel 150km of EV example, the battery capacity decline may lead to shorten the travel distance of 30 ~~ 50km. Perhaps the user wants the performance deterioration of the battery replaced, in this case, even if the battery is priced at 20,000 yen / kWh battery replacement costs 500,000 yen. Assume that every 5 years would cost 500,000 yen replace the battery, then the annual cost burden is 100,000 yen, the user needs to be considered in advance EV maintenance fees.
As mentioned above, the battery life is directly related to the user's EV cost of ownership, so it will become a key element in the car charging battery development. Future, widespread popularity EV and PEHV standing with costs, but also reduce the user's vehicle to the point of view of the cost of ownership and cost assessment, on-board lithium battery. Concern as a strong anti-deterioration performance car lithium battery is a the negative lithium titanate battery. The negative electrode of lithium batteries generally use graphite, but the durability can be improved using the lithium titanate. Toshiba experimental results show that the lithium titanate negative electrode of the lithium battery life when compared with the use of graphite in the traditional lithium may be extended to 6 times. In this case, you do not need during the life of the vehicle due to the deterioration of the battery and replace the battery, it will not cause the user's vehicle with rising costs. Toshiba is currently in mass production car lithium battery using lithium titanate addition to Mitsubishi Motors of this battery will be on the company's EV, Honda is also considering for the company developed the Fit EV.
The lithium-ion rechargeable battery technology is still in its development stage enterprises in order to further technological progress in the fierce competition. In the future, companies develop in-vehicle lithium battery, not only in energy capacity, cost, and security there is often a shift in the relationship between the elements of the (Trade-off) aspects to achieve optimization, but also stand the impact of performance degradation, and contains maintenance fees, including the cost of ownership perspective, comprehensive performance evaluation of the battery.
2013年3月14日星期四
The Role of Capacitor in the Circuit
In the DC circuit, the capacitor is equivalent to the disconnection. The capacitor is a storage charge element, is the most commonly used one of the electronic components.
This was from the capacitor structure on the start. Most simple capacitor is made on the both ends of the plate and the intermediate insulating dielectric (including air) [1] constitute. Energized, the plate charged, forming a voltage (potential difference), but due to the insulating material of the middle, so the entire capacitor is not electrically conductive. However, such a situation is a prerequisite of the not exceed the threshold voltage (breakdown voltage) of the capacitor under. We know, no substances are relatively insulated, when the material both ends of the voltage is increased to a certain extent, the material can be electrically conductive, we call this voltage is called the breakdown voltage. The capacitor is no exception, after the capacitor is the breakdown is not an insulator. However, at the secondary level, this voltage in the circuit is not done so in the breakdown voltage can be used as an insulator see.
However, in an AC circuit, because the direction of the current time as a function of changes. The capacitor charge-discharge process of the time, this time, a changing electric field is formed between the plates, while the electric field is also a function of change over time. In fact, the current through the field in the form adopted in between the capacitors.
In secondary schools, there is a saying called pass AC resistive DC is the capacitance of this nature.
The role of capacitance:
1) bypass
Bypass capacitor is an energy storage device to provide energy for local devices, which enables the output of the regulator homogenization, reducing the load demand. Like small rechargeable battery, bypass capacitor can be charged to the device to discharge. To minimize impedance bypass capacitor as close as possible to the load device powered power supply pin and ground pins. This can be well prevented the elevation of the ground potential caused by the input value is too large, and noise. The ground potential is connected in a voltage drop when a large current glitches.
2) decoupling
Decoupling, also known as decoupling. From the circuit can always be zone is divided into the drive source and the driven load. If the load capacitance is relatively large, the drive circuit capacitor charging should be discharge, to complete the transition of the signal at the rising edge of the steep, relatively large current, current to drive so it will absorb a lot of supply current, the circuit the inductance and resistance (especially on the chip pin inductance, will produce rebound), such a current phase for the normal situation is actually a kind of noise, will affect the normal working of the previous stage, which is called the "coupled" .
Decoupling capacitor is to play the role of a "battery", to meet a change in drive circuit current, to avoid mutual coupling between the interference.
Bypass capacitor and decoupling capacitor combination will be easier to understand. Actual bypass capacitor is decoupled, just bypass capacitor generally refers to the high-frequency bypass to improve high-frequency switching noise is a low impedance to vent anti pathway. Frequency bypass capacitor are generally relatively small, and generally according to the resonant frequency such as 0.1μF, 0.01μF; away coupling capacitor is generally large, it may be 10μF or greater, according distributed parameter circuit, and change the size of the drive current to determine. The bypass is the interference in the input signal as filtered object Decoupling of the output signal of the interference as filtered object, and to prevent return the power of an interference signal. This should be their essential difference.
3) filtering
(Assuming said capacitor is pure capacitance), the greater the capacitance, the smaller the impedance, the higher frequency by theory. But in fact most of the more than 1μF capacitance electrolytic capacitors, the inductance component, high frequency instead impedance increases. Sometimes see a larger electrolytic capacitor manufacturer in parallel with a capacitance of a small capacitor, this time a large capacitor through the low-frequency, small capacitor through high frequency. The capacitance of the role is to pass a high impedance low-pass high-frequency resistance low frequency. Higher capacitance increases the low frequency, the easier to pass. Specific filtering, large capacitors (1000μF) low-frequency filter, small capacitance (20pF) high-frequency filter. Had friends vividly than the filter capacitor as "reservoirs". Since both ends of the capacitor voltage is not mutation Therefore, the higher the frequency the greater the attenuation can be very image of the said capacitor like a pond, not caused by changes in the water due to the addition of a few drops of water or evaporation. It converted to voltage changes in the current changes, the higher the frequency, the greater the peak current, so that the buffer voltage. Filtering is charging, the discharge process.
4) Energy Storage
The energy storage capacitor charge is collected through the rectifier , and the stored energy is transmitted via the inverter leads to the power supply output terminal. The voltage rating of 40 ~ 450VDC, capacitance values between 220 ~ 150 000μF aluminum electrolytic capacitors (such as EPCOS B43504 or B43505) is more commonly used. According to the different power requirements, the device is sometimes used in the form of series, parallel, or combinations thereof, and the power level exceeds the power of 10KW, usually larger tank shaped spiral terminal capacitor.
This was from the capacitor structure on the start. Most simple capacitor is made on the both ends of the plate and the intermediate insulating dielectric (including air) [1] constitute. Energized, the plate charged, forming a voltage (potential difference), but due to the insulating material of the middle, so the entire capacitor is not electrically conductive. However, such a situation is a prerequisite of the not exceed the threshold voltage (breakdown voltage) of the capacitor under. We know, no substances are relatively insulated, when the material both ends of the voltage is increased to a certain extent, the material can be electrically conductive, we call this voltage is called the breakdown voltage. The capacitor is no exception, after the capacitor is the breakdown is not an insulator. However, at the secondary level, this voltage in the circuit is not done so in the breakdown voltage can be used as an insulator see.
However, in an AC circuit, because the direction of the current time as a function of changes. The capacitor charge-discharge process of the time, this time, a changing electric field is formed between the plates, while the electric field is also a function of change over time. In fact, the current through the field in the form adopted in between the capacitors.
In secondary schools, there is a saying called pass AC resistive DC is the capacitance of this nature.
The role of capacitance:
1) bypass
Bypass capacitor is an energy storage device to provide energy for local devices, which enables the output of the regulator homogenization, reducing the load demand. Like small rechargeable battery, bypass capacitor can be charged to the device to discharge. To minimize impedance bypass capacitor as close as possible to the load device powered power supply pin and ground pins. This can be well prevented the elevation of the ground potential caused by the input value is too large, and noise. The ground potential is connected in a voltage drop when a large current glitches.
2) decoupling
Decoupling, also known as decoupling. From the circuit can always be zone is divided into the drive source and the driven load. If the load capacitance is relatively large, the drive circuit capacitor charging should be discharge, to complete the transition of the signal at the rising edge of the steep, relatively large current, current to drive so it will absorb a lot of supply current, the circuit the inductance and resistance (especially on the chip pin inductance, will produce rebound), such a current phase for the normal situation is actually a kind of noise, will affect the normal working of the previous stage, which is called the "coupled" .
Decoupling capacitor is to play the role of a "battery", to meet a change in drive circuit current, to avoid mutual coupling between the interference.
Bypass capacitor and decoupling capacitor combination will be easier to understand. Actual bypass capacitor is decoupled, just bypass capacitor generally refers to the high-frequency bypass to improve high-frequency switching noise is a low impedance to vent anti pathway. Frequency bypass capacitor are generally relatively small, and generally according to the resonant frequency such as 0.1μF, 0.01μF; away coupling capacitor is generally large, it may be 10μF or greater, according distributed parameter circuit, and change the size of the drive current to determine. The bypass is the interference in the input signal as filtered object Decoupling of the output signal of the interference as filtered object, and to prevent return the power of an interference signal. This should be their essential difference.
3) filtering
(Assuming said capacitor is pure capacitance), the greater the capacitance, the smaller the impedance, the higher frequency by theory. But in fact most of the more than 1μF capacitance electrolytic capacitors, the inductance component, high frequency instead impedance increases. Sometimes see a larger electrolytic capacitor manufacturer in parallel with a capacitance of a small capacitor, this time a large capacitor through the low-frequency, small capacitor through high frequency. The capacitance of the role is to pass a high impedance low-pass high-frequency resistance low frequency. Higher capacitance increases the low frequency, the easier to pass. Specific filtering, large capacitors (1000μF) low-frequency filter, small capacitance (20pF) high-frequency filter. Had friends vividly than the filter capacitor as "reservoirs". Since both ends of the capacitor voltage is not mutation Therefore, the higher the frequency the greater the attenuation can be very image of the said capacitor like a pond, not caused by changes in the water due to the addition of a few drops of water or evaporation. It converted to voltage changes in the current changes, the higher the frequency, the greater the peak current, so that the buffer voltage. Filtering is charging, the discharge process.
4) Energy Storage
The energy storage capacitor charge is collected through the rectifier , and the stored energy is transmitted via the inverter leads to the power supply output terminal. The voltage rating of 40 ~ 450VDC, capacitance values between 220 ~ 150 000μF aluminum electrolytic capacitors (such as EPCOS B43504 or B43505) is more commonly used. According to the different power requirements, the device is sometimes used in the form of series, parallel, or combinations thereof, and the power level exceeds the power of 10KW, usually larger tank shaped spiral terminal capacitor.
2013年3月5日星期二
White LED Driver Must have Conditions
In recent years portable electronic equipment mostly switched to the forward voltage is 6V (20mA), the white LED as a backlight of the LCD, such as a mobile phone takes about 3 ~ 4 white LEDs general lithium ion battery, however, the discharge voltage is often less than 3. 6V, therefore must use in order to comply with the white LED forward voltage 3 6V demand, boost circuit in order to obtain the desired effect, means that the white LED driver must have to meet: even if the battery output voltage required for normal forward voltage UF-down, the drive can also be provided for the white LED.
Poor white LED's forward voltage drop match early white LED driver should match the current limiting resistor, to compensate for the forward voltage differences, in order to ensure white LED brightness consistency. However, the newly developed white LED driver IC supply voltage can not maintain a constant brightness. Upgrade and adjust the battery voltage driver IC can be open or closed loop controller, charge pump or inductive converter with voltage or current output.
In most applications, the white LED is in parallel or in series together. However, in individual cases, it also can be mixed in series and parallel configurations. LED connection in series or in parallel or hybrid depending on the needs of the application, each configuration has its own advantages and shortcomings.
1. The series. The white LED has a the similar diode forward voltage and current characteristics. Since the white LED brightness almost entirely by the current control, therefore, just use the same or match the current, two white LED light can be obtained the same brightness, without having to consider the difference of the forward voltage. White LED connected in series to ensure that its current is the same, therefore all white LED brightness is consistent.
2. The parallel. Most parallel white LED configurations use a constant voltage or constant current drive, and the drive is used depends on the specific application requirements. Parallel white LED driver in a constant voltage topology is very simple, the drive can be open-loop voltage output switching DC / DC regulator converter. Each white LED series with a current limiting resistor to set the current value of the match between the current white LED. Constant voltage drive with high current-limiting resistor value, you can get a good current matching, but the negative impact efficiency. Conversely, the lower the current-limiting resistor value will provide a higher efficiency, but the matching effect of the white LED current (brightness) is poor.
The first generation of constant current drive with a constant current charge pump, these IC to detect white LED current limiting resistor. They may utilize the sensed current to adjust the first white LED forward current, its Yu Baiguang LED current limiting resistor, the current value will be matched with the first white LED current. Since the forward voltage between the white LED is not identical and therefore the accuracy of the current match is very limited. Applications requiring accurate current matching color LCD display, you can use the internal drive with constant current function, these drives provide accurate current matching between the white LED, without regard to its forward voltage.
White LED forward voltage is relatively high, the latest technology trend is to white LED forward voltage is decreased to 3V or less. Its nominal voltage value of 3. 6V, white LED forward voltage is lower than 3V 2. 7 ~ 4. 2V, by a single lithium-ion battery voltage range can be lithium-ion battery directly drive a white LED circuit ( without boost), thereby reducing the number of parts and cost.
Unlike traditional white LED driver IC, the white LED driver using active matching techniques in order to achieve a constant brightness white LED with a built-in digital, analog and PWM control unit to adjust the white LED brightness. The Fairchild the latest FAN5608LED of the drive to integrate the brightness control mode (digital, analog, PWM), and supports a special configuration program. It uses two constant current source drives two white LED series branch, each SMD LED series branch has a separate brightness control, 4 white LEDs in series for each white LED series support on the road, so as to meet the driving eight white LED's requirements.
Poor white LED's forward voltage drop match early white LED driver should match the current limiting resistor, to compensate for the forward voltage differences, in order to ensure white LED brightness consistency. However, the newly developed white LED driver IC supply voltage can not maintain a constant brightness. Upgrade and adjust the battery voltage driver IC can be open or closed loop controller, charge pump or inductive converter with voltage or current output.
In most applications, the white LED is in parallel or in series together. However, in individual cases, it also can be mixed in series and parallel configurations. LED connection in series or in parallel or hybrid depending on the needs of the application, each configuration has its own advantages and shortcomings.
1. The series. The white LED has a the similar diode forward voltage and current characteristics. Since the white LED brightness almost entirely by the current control, therefore, just use the same or match the current, two white LED light can be obtained the same brightness, without having to consider the difference of the forward voltage. White LED connected in series to ensure that its current is the same, therefore all white LED brightness is consistent.
2. The parallel. Most parallel white LED configurations use a constant voltage or constant current drive, and the drive is used depends on the specific application requirements. Parallel white LED driver in a constant voltage topology is very simple, the drive can be open-loop voltage output switching DC / DC regulator converter. Each white LED series with a current limiting resistor to set the current value of the match between the current white LED. Constant voltage drive with high current-limiting resistor value, you can get a good current matching, but the negative impact efficiency. Conversely, the lower the current-limiting resistor value will provide a higher efficiency, but the matching effect of the white LED current (brightness) is poor.
The first generation of constant current drive with a constant current charge pump, these IC to detect white LED current limiting resistor. They may utilize the sensed current to adjust the first white LED forward current, its Yu Baiguang LED current limiting resistor, the current value will be matched with the first white LED current. Since the forward voltage between the white LED is not identical and therefore the accuracy of the current match is very limited. Applications requiring accurate current matching color LCD display, you can use the internal drive with constant current function, these drives provide accurate current matching between the white LED, without regard to its forward voltage.
White LED forward voltage is relatively high, the latest technology trend is to white LED forward voltage is decreased to 3V or less. Its nominal voltage value of 3. 6V, white LED forward voltage is lower than 3V 2. 7 ~ 4. 2V, by a single lithium-ion battery voltage range can be lithium-ion battery directly drive a white LED circuit ( without boost), thereby reducing the number of parts and cost.
Unlike traditional white LED driver IC, the white LED driver using active matching techniques in order to achieve a constant brightness white LED with a built-in digital, analog and PWM control unit to adjust the white LED brightness. The Fairchild the latest FAN5608LED of the drive to integrate the brightness control mode (digital, analog, PWM), and supports a special configuration program. It uses two constant current source drives two white LED series branch, each SMD LED series branch has a separate brightness control, 4 white LEDs in series for each white LED series support on the road, so as to meet the driving eight white LED's requirements.
2013年2月26日星期二
The Technical Advantages of World's Seven Major LED Chip Manufacturers
1. Cree
Cree is a market-leading innovator and semiconductor manufacturers to significantly improve the energy effect of the solid-state lighting, power and communications products to increase their value.
Cree's market advantage key from the company alone gallium nitride (GaN), silicon carbide (SiC) a material expertise to manufacture chips and a set of devices. These chips and a set of devices in a small space with more power and less heat than other available technologies, materials and products.
Career Energy regression solutions for a variety of purposes, including lighter and adjustable LED light for general illumination, bright backlit display, and the best power management for high-current switching power supplies and variable speed motors, and more exciting options for effective data and voice communications wireless infrastructure. Cree customers from innovative lighting manufacturers to defense-related federal agencies.
Cree's product line includes blue and green light-emitting diode chips, lighting LEDs, backlight light-emitting diodes, light-emitting diodes for power switching devices and radio frequency equipment and radio equipment.
Technical advantages
1. The SiC base Ⅲ nitride epitaxy, chip-scale packaging technology;
2. The high-power chip and packaging technologies.
2008-2009 Enterprise
2008 Career achieved a 25% growth in annual revenue, to $ 493 million, including LED product sales revenue of $ 415 million, accounting for 84% of the total income of M & A the INTRINSIC and the COTCO and investment in marketing links make sales management costs compared with an increase of 44% in 2007; growth in 2007, more than three times the corresponding expenses in the financial statements due to mergers and acquisitions of the two companies bring hidden assets depreciation.
Cree attributed to the growth of its performance it developed and implemented strategic points: the XLamp LEDs sales growth of 140% over 2007 successful mergers and acquisitions LLF COTCO and achieve expected revenue target to double sales of spare parts through distribution channels, as well as through expansion in Asia, including the XLamp production shifted to China, greatly reduce the cost of production.
Of technology to increase investment, to achieve the industry's best R & D report results - 161 lumens per watt, while white power LED, Cree also expand the range of applications for its products. 2008, Cree (Cree) for the campus and the main streets of the United States, designed and installed based lighting systems to save energy and reduce maintenance costs, and laid the foundation for the future development of the indoor and outdoor general lighting market. Its sponsorship and participation in the lighting project include: LED city, LED the workplace and LED University. The development in the field of general lighting applications as well as the company offset the growth in sales of power and RF products due to lead to a decline in sales of the LED chip and high brightness LED components affect consumers reduce demand for mobile phones and automotive applications.
In addition, Cree, Mitsubishi Chemical Corporation signed a patent license agreement, given the production and sale of an exclusive license GaN substrate. The Cree then the charge provided for in the agreement of sale GaN substrate protection and royalties. With BridgeLux company reached an agreement on the patent infringement lawsuit. In accordance with the supply agreement reached after another, Cree will become an important supplier of BridgeLux company.
2. Osram
OSRAM is one of the two leading lighting manufacturers in the world, headquartered in Munich, Germany, R & D and manufacturing base in Malaysia, is a wholly owned subsidiary of Siemens. Fiscal year 2007 (ended September 30, 2007), Osram Sales results of up to 4.7 billion euros.
OSRAM customers in nearly 150 countries and regions around the world. With innovative lighting technologies and solutions, Osram constantly develop new areas of artificial light sources, the products are widely used in public places, offices, factories, household and automotive lighting.
OSRAM has a number of the world's leading patent, many world famous works are selected Osram lighting products and solutions. From the world's high-rise building, Taipei 101 Building, from the 2000 Sydney Olympic Stadium, the 2006 World Cup in Munich Allianz Arena; the, Sweden Malmo rotation Building from solemn Tiananmen Square in Beijing, classic to modern architecture to the Luxurious Burj Al Arab; ... Osram lighting products shine in them.
OSRAM has three production bases in China, and has a research and development center, the total number of employees nearly 8,000 people in China. OSRAM lighting (China) Co., Ltd. was established in 1995, the company employs about 3,500 people, has nearly 40 sales offices across the country. Osram Osram Asia-Pacific region has become a center of competence in China, and plays an important role in the Osram global strategy.
Osram's lighting products up to more than 5,000 species, able to fully meet the various needs of people in work, life and special fields. Its product line includes: fluorescent lamps, compact fluorescent lamps, high intensity discharge lamps, halogen lamps, car lights, motorcycle lights, special light source and electronic ballast and light-emitting diodes. The state-of-the-art electronic management system and improved logistics and distribution network to achieve the desire of of Osram products and services to millions of households.
Technical advantages
1. SiC substrate "Faceting";
2. White LED with a fluorescent material having a leading edge;
3. zz is mounted power package technology and car lighting technology.
2008-2009 Enterprise
Osram 4.624 billion euros in 2008, representing a decrease of 1% compared with 2007. General lighting total revenue 16% of 51% of automotive lighting lighting 4% other semiconductor and optical equipment 29% the Osram financial expenses in 2008 for 386 million euros, 284 million in 2007. Osram equally optimistic about the prospects for the development of the LED firmly believe that LED 2020 will occupy at least 1/3 of the general lighting market. The technical side, the company will be 5.8% of revenue reinvested research and development, OSRAM Opto Semiconductors R & D reinvested ratio is as high as 15.1%.
In 2008, Osram still continue its efforts in the front-end and high-end lighting applications, such as architectural lighting design, landscape lighting, as well as operating innovative small / handheld lamps and so on. The company also increased the research and development of OLED, especially in the field of lighting applications, while vigorously developing off-grid lighting and energy saving and environmental protection, the biggest advantage of the lighting system, the company has the appropriate technology and products in Africa, India and other countries and regions vigorously promotion. Meantime Osram and Cree as increased reliance on the Asia-Pacific market. In 2008, the U.S. and European markets for Osram 77% of the sales revenue, 18% in the Asia-Pacific region. Since 2007, after the establishment of the company's R & D and production center in Malaysia, Osram has established its Asia Pacific headquarters in Hong Kong, focusing on the development of the Chinese and Indian markets .
The world economy, especially the decline of the auto industry leader in automotive lighting industry has been greatly affected. For the auto industry downturn, Osram believes that recovery is sooner or later, and efficient quality automotive lighting system is irreplaceable. The company said it will control the use of cost-cutting measures of aspects, but to pay more attention to the more long-term benefits in technology and market-oriented strategy.
3. Philips
Philips Lighting is provided for all areas of advanced energy-efficient solutions, including: roads, office, industrial, entertainment and home lighting. Build the future of the new lighting applications and use of technology, Philips is also among the leadership position, such as LED technology. The company's main products include xenon car lights, road lighting, mood lighting.
Philips to establish leadership in the field of LED chip is mainly due to the acquisition of Lumileds from Agilent and Philips, Lumileds joint venture in 1999, 2005 Philips acquired the company completely. Philips Lumileds is the world's leading high-power LED lighting solutions provider. The company has always been committed to promoting the development of solid-state lighting technology, environmentally friendly lighting solutions, helping to reduce carbon dioxide emissions and reduce the need for plant expansion, the company's leading light output, efficacy and thermal management is long-term efforts in this regard a direct result. The Philips Lumileds LUXEONLED provide a new choice for shop, outdoor, office, school, and home lighting solutions. Philips Lumileds offers a variety of LED chips and LED packaging, red, green, blue, amber, and white LED products.
Technical advantages
1. Unique heat sink design and Si-Submount "Flip-Chip" packaging technology;
2. Has a first-mover advantage in high-power white light illumination die.
2008-2009 Enterprise
Philips sales growth of 17% in 2008 mainly to support the acquisition of Genlyte and Color Kinetics. 18% of the adjusted portfolio changes and adverse exchange rate effects of 4% of sales in 2007, up 3%. This increase was primarily due to continued sales growth of energy-efficient lighting solutions,. The company's diverse product areas to maintain a considerable level of profitability in the second half of 2008, the deteriorating economic situation in the case of sharp drop in demand for automotive, consumer goods and construction industries. Compared to 2007, sales of green products grew by 12 percent to 2.97 billion euros. This increase was primarily from an increase in sales, including solid-state lighting applications, as well as the design of product innovation and strong growth in application solutions based in 2008 in the SSL field income increased 6 percent to 470 million euros.
From a regional point of view, in the mature markets, sales declined slightly compared to 2007; in North America and Western Europe, the deteriorating economic environment in the automotive, consumer goods and building lighting market losses more than offset gains in energy-efficient lighting solutions. Emerging market sales increased 8% where all the business in India, Eastern Europe and the ASEAN countries (in addition to a special lighting applications), have gained a strong double-digit sales growth.
2008, interest, taxes, depreciation rate of euro 538 million accounted for 7.6% of sales compared to 184 million in 2007, including 221 million euros of restructuring costs and euro 041 million of acquisition-related costs. 2008 earnings also impact by mature markets gross margin compression and benefit from acquisitions, partially offset by the impact of a slowdown in demand for automotive and architectural lighting field.
Company EBIT in 2008 amounted to 165 million euros, 675 million euros in 2007. 2008, PHILIPS Lumileds declared a euro 232 million non-cash goodwill impairment, which is mainly due to weak demand in automotive, display and mobile phone market.
The before financing cash flow activities including cash payment of 1.825 billion euros, mainly related to the acquisition of Genlyte expenditures related to the acquisition in 2007 amounted to 1.162 billion euros, mainly related to the acquisition of PLI and Color Kinetics. In addition to the above acquisition related payments, cash flow compared to 2007 due to the improvement of working capital requirements before financing activities increased by 173 million euros, due to higher investment in solid-state lighting solutions, the company's net capital expenditure also increased by 054 million euros.
In view of the economic outlook may continue to deteriorate, PHILIPS think that 2009 was a very challenging year, the company not only to keep the amount of the contract for the construction and automotive markets, we must strive to maintain consumer confidence in most emerging markets. In this environment, PHILIPS expand the restructuring plan will be active, choose more effective cash management measures to further reduce the (fixed) costs last year, and to ensure a favorable balance sheet presented to investors in 2009. To achieve sound financial management, the company will stop the share repurchase program, In addition the company will also continue to closely manage the situation in the market and competition. PHILIPS hope through strict cost and cash management, coupled with strong brand advantage and balanced portfolio, to enable them to tide over the current economic turmoil, the conditions to be economic recovery, and to be able to achieve more powerful target.
4. Nichia
Nichia, famous LED chip manufacturers, Japan, was established in 1956, developed the world a blue LED (1993), a pure green LED (1995), built around the world have child company.
Nichia Corporation for the purpose of "Ever Researching for a Brighter World", has so far committed to the manufacture and sale of phosphor (inorganic phosphors) center precision chemicals. Blue LED that shocked the world in the process of development of a light-emitting substance, was published in 1993, have since realized the commercialization of UV, yellow nitride LED white LED, a significant expansion of the LED applications. In addition, Nichia Chemical Company is making great efforts to develop indispensable for the development of information media violet blue laser diode, hope that the nitride semiconductor can become an important part of the field in the semiconductor industry.
Technical advantages
1. First, only the commercialization of GaN-based blue LED / LD;
2. Have the best phosphor technology;
3. The blue excitation yellow phosphor technology patented;
4. A sapphire substrate, epitaxial growth techniques.
2008-2009 Enterprise
In terms of market share, according to the British market research firm IMS Research report shows, the total revenue of the LED package products in 2007, Nichia to 24% of the global market share topped the list, the agency also noted that, although the 008 years of market ranking has not been announced, but Nichia undoubtedly will continue to be the 2008 LED packaging product sales champion.
In the field of technology research and development, in 2008, engaged in intellectual property related consulting business in Japan Intellectual Property Bank (hereinafter referred to as IPB) from the quantity and quality of the application for patent for the evaluation criteria, manufacturers engaged in the LED lighting business technology competitiveness ranking that Nichia technology is the most competitive. According to the the IPB statistics, the the open classes patent issued from January 1993 to February 2008 communique about 5400, which Nichia ranked third in the number of applications, but the performance in terms of quality, especially in the "LED components The three areas of the phosphor material "LED encapsulation" overwhelming.
Is particularly worth mentioning is that between 2008 and 2009, Nichia various forms of cross-licensing agreement signed with a number of enterprises. Among them, February 2, 2009, a cross-licensing agreement signed by Nichia and Seoul Semiconductor most concern, this marks the two companies will officially stop took four years, in the United States, Germany, Japan, United Kingdom, South Korea all patent lawsuit case, the cross-licensing agreement covering LED and LD (laser diode) technology, these technologies will allow both sides have unlimited access to each other's patents. In addition, Nichia and Sharp, Luminus, AgiLight companies signed a cross-licensing agreement.
5. Seoul Semiconductor
Seoul Semiconductor in recent years the rapid growth rate, has been promoted to the list of the world's top LED chip manufacturers. According to British market research firm IMS Research report shows, the total revenue of Seoul Semiconductor LED packaging products in 2007 ranked fourth in the world.
Seoul Semiconductor (strains) in 2006 and 2007, respectively, two magazines Forbes and Business Week selected as the "2006 Asia's most promising enterprises," the possibility of being recognized. The the Seoul Semiconductor main product AC power semiconductor light source ACRICHE Europe's most authoritative magazine Elektronik selected as the "Most Outstanding Product Award" in 2008 has also been granted by the Ministry of the knowledge-based economy "Technology Award of the Republic of Korea" and was looking forward to become a pilot and abroad light source market enterprises. 2008 total sales of 284.1 billion yuan, to ensure that more than 5,000 patents. Features including three local subsidiary 25 overseas sales offices, 114 distributors worldwide.
Seoul Semiconductor's main business is the production line of LED packaging and custom module products, including AC-driven semiconductor light source products, such as: Acriche, high-brightness high power LED, side light LED, top light LED, SMD LED, plug-in LED and Piranha (Super Light) LED. The products have been widely used in the scope of general lighting, display lighting, mobile phone backlight, TV, laptop computers, automotive lighting, household goods and traffic signals.
Technical advantages
1. by the light and the light-emitting composite, with "MODULE" technology;
2. with the "DIGITAL" circuit technology;
3. with the solution, including the blue light, white LED;
4. with the ultra-miniature, ultra-thin technology.
2008-2009 Enterprise
Seoul Semiconductor in 2008 sales of 264.1 billion won in 2007 to 184.626 billion, an increase of 43% of the company's sales and administrative expenses increased by 1.5 times, but R & D spending grew by 40% overall, EBIT and net profit were achieved in 2007 on the basis of a double.
British market research firm IMS Research report shows that in 2008, the total revenue of the global LED packaging products among the world's top three LED manufacturing enterprises are facing a strong challenge from Seoul, Korea Semiconductor, IMS Research company analysts believe In recent years, Seoul Semiconductor's growth rate is faster than the overall LED market, and have been steadily rising, Philips Lumileds may face in the next few years, the competition for the third largest LED supplier from Seoul Semiconductor.
In 2008, the company's expansion plans its fixed assets and equipment grew 41% capacity increase also led to a 65% increase in inventory. Seoul Semiconductor and Nichia patent disputes with each other to sign a cross-licensing agreement in February 2009, as the end, Seoul Semiconductor also silicate-based phosphor white LED patent cross-licensing agreement signed with LED Tridonic. Role in promoting the good news of the company's market capitalization. 2009, the company Acriche and Z-Power LED products in the U.S. and European markets professional praise.
6. Toyoda Gosei
Toyoda Gosei, headquartered in Aichi, Japan, the production of automobile parts and LEDLED revenue accounts for about 10%.
Toyoda Gosei and Toshiba jointly developed white LED UV LED and phosphor combination with general blue LED and phosphor combination of different ways. If the LED is likened to a car, then it can be said, Nichia Chemical propose the concept of the wheels and the engine, Toyoda Gosei proposed the concept of the body and tires. 1986, commissioned by the Honorary Professor Akasaki Mr. Toyoda Gosei own accumulation of membrane technology in the auto parts, LED R & D work to commence. 1987, development commissioned by the Science and Technology Corporation, Toyoda Gosei successfully formed on the sapphire LED electrode. Therefore, the Toyoda Gosei as "the vanguard of the blue LED is not an exaggeration. Toyoda Gosei is quite fast pace of development in the recent years. In 1998, its sales of 6.3 billion yen, but in 2002, has grown to 25.2 billion yen.
In 2003, due to the lack of phone white light source brightness, China, Taiwan and South Korea to take a low-cost strategy as well as the European display market downturn and many other reasons, resulting in Toyoda Gosei original plan to sell 34 billion yen task could not be completed, but its sales turnover and profits have reached the highest level in history. Which growth is a phone dedicated white LED, an increase of 12.3 billion yen from 2.7 billion yen in 2002, accounting for four percent of the total sales. The rest of the blue, blue-green the 3in1-white LED.2003 years, domestic sales accounted for 8 percent, to 23.7 billion yen. Overseas sales: 4.7 billion yen in Asia. In the application, the phone accounted for 72%. Addition, the the applications more LCD backlight button, the back of the LCD backlight (3in1). Signal equipment, large display applications.
In 2004, Toyoda Gosei's original plan to sell 42 billion yen, due to the downturn in the mobile phone market, and it had sales plan amendment for 30 billion yen. To attack wins Nichia Chemical occupy phone backlight market 90% of the market share, Toyota synthesis intent to improve white LED light brightness, in the fall of 2004 to develop the brightness to 1000mcd level of white LED "TGWHITE Ⅱ" This original 600-700mcd bright a lot. Then, Toyota compounds began developing 1300mcd white LED. Addition, car navigation systems and computers dedicated LCD controller, TV dedicated a large LCD backlight Toyota compounds target market. Lighting applications design and development are in full swing. The Toyota compounds production facilities in addition to the outside Aichi calm cho factory, still in Saga Prefecture Takeo City to establish a second production base production of blue LED GaNLED. Equipment investment amounted to 15.6 billion yen, the planned production reached 200 million in 2006 years. When the total production capacity of the two plants per month to 420 million, the 2008 LED sales of 120 billion yen.
7. Agilent (Agilent)
Agilent as the world's leading LED supplier, its products for the automotive, electronic information boards and traffic signal lights, industrial equipment, cellular phones, and consumer products to a large number of products to provide efficient, reliable light source. The high reliability of these components are usually guaranteed during the service life of the equipment do not have to replace the light source. Agilent's low-cost dot matrix LED display, variety of seven segment display and Agilent LED light, strip products have a variety of packages and colors to choose from. Agilent was first isolated from Hewlett-Packard. Hewlett-Packard Company in 1999 into two, her optoelectronics division was established as Agilent Technologies.
Cree is a market-leading innovator and semiconductor manufacturers to significantly improve the energy effect of the solid-state lighting, power and communications products to increase their value.
Cree's market advantage key from the company alone gallium nitride (GaN), silicon carbide (SiC) a material expertise to manufacture chips and a set of devices. These chips and a set of devices in a small space with more power and less heat than other available technologies, materials and products.
Career Energy regression solutions for a variety of purposes, including lighter and adjustable LED light for general illumination, bright backlit display, and the best power management for high-current switching power supplies and variable speed motors, and more exciting options for effective data and voice communications wireless infrastructure. Cree customers from innovative lighting manufacturers to defense-related federal agencies.
Cree's product line includes blue and green light-emitting diode chips, lighting LEDs, backlight light-emitting diodes, light-emitting diodes for power switching devices and radio frequency equipment and radio equipment.
Technical advantages
1. The SiC base Ⅲ nitride epitaxy, chip-scale packaging technology;
2. The high-power chip and packaging technologies.
2008-2009 Enterprise
2008 Career achieved a 25% growth in annual revenue, to $ 493 million, including LED product sales revenue of $ 415 million, accounting for 84% of the total income of M & A the INTRINSIC and the COTCO and investment in marketing links make sales management costs compared with an increase of 44% in 2007; growth in 2007, more than three times the corresponding expenses in the financial statements due to mergers and acquisitions of the two companies bring hidden assets depreciation.
Cree attributed to the growth of its performance it developed and implemented strategic points: the XLamp LEDs sales growth of 140% over 2007 successful mergers and acquisitions LLF COTCO and achieve expected revenue target to double sales of spare parts through distribution channels, as well as through expansion in Asia, including the XLamp production shifted to China, greatly reduce the cost of production.
Of technology to increase investment, to achieve the industry's best R & D report results - 161 lumens per watt, while white power LED, Cree also expand the range of applications for its products. 2008, Cree (Cree) for the campus and the main streets of the United States, designed and installed based lighting systems to save energy and reduce maintenance costs, and laid the foundation for the future development of the indoor and outdoor general lighting market. Its sponsorship and participation in the lighting project include: LED city, LED the workplace and LED University. The development in the field of general lighting applications as well as the company offset the growth in sales of power and RF products due to lead to a decline in sales of the LED chip and high brightness LED components affect consumers reduce demand for mobile phones and automotive applications.
In addition, Cree, Mitsubishi Chemical Corporation signed a patent license agreement, given the production and sale of an exclusive license GaN substrate. The Cree then the charge provided for in the agreement of sale GaN substrate protection and royalties. With BridgeLux company reached an agreement on the patent infringement lawsuit. In accordance with the supply agreement reached after another, Cree will become an important supplier of BridgeLux company.
2. Osram
OSRAM is one of the two leading lighting manufacturers in the world, headquartered in Munich, Germany, R & D and manufacturing base in Malaysia, is a wholly owned subsidiary of Siemens. Fiscal year 2007 (ended September 30, 2007), Osram Sales results of up to 4.7 billion euros.
OSRAM customers in nearly 150 countries and regions around the world. With innovative lighting technologies and solutions, Osram constantly develop new areas of artificial light sources, the products are widely used in public places, offices, factories, household and automotive lighting.
OSRAM has a number of the world's leading patent, many world famous works are selected Osram lighting products and solutions. From the world's high-rise building, Taipei 101 Building, from the 2000 Sydney Olympic Stadium, the 2006 World Cup in Munich Allianz Arena; the, Sweden Malmo rotation Building from solemn Tiananmen Square in Beijing, classic to modern architecture to the Luxurious Burj Al Arab; ... Osram lighting products shine in them.
OSRAM has three production bases in China, and has a research and development center, the total number of employees nearly 8,000 people in China. OSRAM lighting (China) Co., Ltd. was established in 1995, the company employs about 3,500 people, has nearly 40 sales offices across the country. Osram Osram Asia-Pacific region has become a center of competence in China, and plays an important role in the Osram global strategy.
Osram's lighting products up to more than 5,000 species, able to fully meet the various needs of people in work, life and special fields. Its product line includes: fluorescent lamps, compact fluorescent lamps, high intensity discharge lamps, halogen lamps, car lights, motorcycle lights, special light source and electronic ballast and light-emitting diodes. The state-of-the-art electronic management system and improved logistics and distribution network to achieve the desire of of Osram products and services to millions of households.
Technical advantages
1. SiC substrate "Faceting";
2. White LED with a fluorescent material having a leading edge;
3. zz is mounted power package technology and car lighting technology.
2008-2009 Enterprise
Osram 4.624 billion euros in 2008, representing a decrease of 1% compared with 2007. General lighting total revenue 16% of 51% of automotive lighting lighting 4% other semiconductor and optical equipment 29% the Osram financial expenses in 2008 for 386 million euros, 284 million in 2007. Osram equally optimistic about the prospects for the development of the LED firmly believe that LED 2020 will occupy at least 1/3 of the general lighting market. The technical side, the company will be 5.8% of revenue reinvested research and development, OSRAM Opto Semiconductors R & D reinvested ratio is as high as 15.1%.
In 2008, Osram still continue its efforts in the front-end and high-end lighting applications, such as architectural lighting design, landscape lighting, as well as operating innovative small / handheld lamps and so on. The company also increased the research and development of OLED, especially in the field of lighting applications, while vigorously developing off-grid lighting and energy saving and environmental protection, the biggest advantage of the lighting system, the company has the appropriate technology and products in Africa, India and other countries and regions vigorously promotion. Meantime Osram and Cree as increased reliance on the Asia-Pacific market. In 2008, the U.S. and European markets for Osram 77% of the sales revenue, 18% in the Asia-Pacific region. Since 2007, after the establishment of the company's R & D and production center in Malaysia, Osram has established its Asia Pacific headquarters in Hong Kong, focusing on the development of the Chinese and Indian markets .
The world economy, especially the decline of the auto industry leader in automotive lighting industry has been greatly affected. For the auto industry downturn, Osram believes that recovery is sooner or later, and efficient quality automotive lighting system is irreplaceable. The company said it will control the use of cost-cutting measures of aspects, but to pay more attention to the more long-term benefits in technology and market-oriented strategy.
3. Philips
Philips Lighting is provided for all areas of advanced energy-efficient solutions, including: roads, office, industrial, entertainment and home lighting. Build the future of the new lighting applications and use of technology, Philips is also among the leadership position, such as LED technology. The company's main products include xenon car lights, road lighting, mood lighting.
Philips to establish leadership in the field of LED chip is mainly due to the acquisition of Lumileds from Agilent and Philips, Lumileds joint venture in 1999, 2005 Philips acquired the company completely. Philips Lumileds is the world's leading high-power LED lighting solutions provider. The company has always been committed to promoting the development of solid-state lighting technology, environmentally friendly lighting solutions, helping to reduce carbon dioxide emissions and reduce the need for plant expansion, the company's leading light output, efficacy and thermal management is long-term efforts in this regard a direct result. The Philips Lumileds LUXEONLED provide a new choice for shop, outdoor, office, school, and home lighting solutions. Philips Lumileds offers a variety of LED chips and LED packaging, red, green, blue, amber, and white LED products.
Technical advantages
1. Unique heat sink design and Si-Submount "Flip-Chip" packaging technology;
2. Has a first-mover advantage in high-power white light illumination die.
2008-2009 Enterprise
Philips sales growth of 17% in 2008 mainly to support the acquisition of Genlyte and Color Kinetics. 18% of the adjusted portfolio changes and adverse exchange rate effects of 4% of sales in 2007, up 3%. This increase was primarily due to continued sales growth of energy-efficient lighting solutions,. The company's diverse product areas to maintain a considerable level of profitability in the second half of 2008, the deteriorating economic situation in the case of sharp drop in demand for automotive, consumer goods and construction industries. Compared to 2007, sales of green products grew by 12 percent to 2.97 billion euros. This increase was primarily from an increase in sales, including solid-state lighting applications, as well as the design of product innovation and strong growth in application solutions based in 2008 in the SSL field income increased 6 percent to 470 million euros.
From a regional point of view, in the mature markets, sales declined slightly compared to 2007; in North America and Western Europe, the deteriorating economic environment in the automotive, consumer goods and building lighting market losses more than offset gains in energy-efficient lighting solutions. Emerging market sales increased 8% where all the business in India, Eastern Europe and the ASEAN countries (in addition to a special lighting applications), have gained a strong double-digit sales growth.
2008, interest, taxes, depreciation rate of euro 538 million accounted for 7.6% of sales compared to 184 million in 2007, including 221 million euros of restructuring costs and euro 041 million of acquisition-related costs. 2008 earnings also impact by mature markets gross margin compression and benefit from acquisitions, partially offset by the impact of a slowdown in demand for automotive and architectural lighting field.
Company EBIT in 2008 amounted to 165 million euros, 675 million euros in 2007. 2008, PHILIPS Lumileds declared a euro 232 million non-cash goodwill impairment, which is mainly due to weak demand in automotive, display and mobile phone market.
The before financing cash flow activities including cash payment of 1.825 billion euros, mainly related to the acquisition of Genlyte expenditures related to the acquisition in 2007 amounted to 1.162 billion euros, mainly related to the acquisition of PLI and Color Kinetics. In addition to the above acquisition related payments, cash flow compared to 2007 due to the improvement of working capital requirements before financing activities increased by 173 million euros, due to higher investment in solid-state lighting solutions, the company's net capital expenditure also increased by 054 million euros.
In view of the economic outlook may continue to deteriorate, PHILIPS think that 2009 was a very challenging year, the company not only to keep the amount of the contract for the construction and automotive markets, we must strive to maintain consumer confidence in most emerging markets. In this environment, PHILIPS expand the restructuring plan will be active, choose more effective cash management measures to further reduce the (fixed) costs last year, and to ensure a favorable balance sheet presented to investors in 2009. To achieve sound financial management, the company will stop the share repurchase program, In addition the company will also continue to closely manage the situation in the market and competition. PHILIPS hope through strict cost and cash management, coupled with strong brand advantage and balanced portfolio, to enable them to tide over the current economic turmoil, the conditions to be economic recovery, and to be able to achieve more powerful target.
4. Nichia
Nichia, famous LED chip manufacturers, Japan, was established in 1956, developed the world a blue LED (1993), a pure green LED (1995), built around the world have child company.
Nichia Corporation for the purpose of "Ever Researching for a Brighter World", has so far committed to the manufacture and sale of phosphor (inorganic phosphors) center precision chemicals. Blue LED that shocked the world in the process of development of a light-emitting substance, was published in 1993, have since realized the commercialization of UV, yellow nitride LED white LED, a significant expansion of the LED applications. In addition, Nichia Chemical Company is making great efforts to develop indispensable for the development of information media violet blue laser diode, hope that the nitride semiconductor can become an important part of the field in the semiconductor industry.
Technical advantages
1. First, only the commercialization of GaN-based blue LED / LD;
2. Have the best phosphor technology;
3. The blue excitation yellow phosphor technology patented;
4. A sapphire substrate, epitaxial growth techniques.
2008-2009 Enterprise
In terms of market share, according to the British market research firm IMS Research report shows, the total revenue of the LED package products in 2007, Nichia to 24% of the global market share topped the list, the agency also noted that, although the 008 years of market ranking has not been announced, but Nichia undoubtedly will continue to be the 2008 LED packaging product sales champion.
In the field of technology research and development, in 2008, engaged in intellectual property related consulting business in Japan Intellectual Property Bank (hereinafter referred to as IPB) from the quantity and quality of the application for patent for the evaluation criteria, manufacturers engaged in the LED lighting business technology competitiveness ranking that Nichia technology is the most competitive. According to the the IPB statistics, the the open classes patent issued from January 1993 to February 2008 communique about 5400, which Nichia ranked third in the number of applications, but the performance in terms of quality, especially in the "LED components The three areas of the phosphor material "LED encapsulation" overwhelming.
Is particularly worth mentioning is that between 2008 and 2009, Nichia various forms of cross-licensing agreement signed with a number of enterprises. Among them, February 2, 2009, a cross-licensing agreement signed by Nichia and Seoul Semiconductor most concern, this marks the two companies will officially stop took four years, in the United States, Germany, Japan, United Kingdom, South Korea all patent lawsuit case, the cross-licensing agreement covering LED and LD (laser diode) technology, these technologies will allow both sides have unlimited access to each other's patents. In addition, Nichia and Sharp, Luminus, AgiLight companies signed a cross-licensing agreement.
5. Seoul Semiconductor
Seoul Semiconductor in recent years the rapid growth rate, has been promoted to the list of the world's top LED chip manufacturers. According to British market research firm IMS Research report shows, the total revenue of Seoul Semiconductor LED packaging products in 2007 ranked fourth in the world.
Seoul Semiconductor (strains) in 2006 and 2007, respectively, two magazines Forbes and Business Week selected as the "2006 Asia's most promising enterprises," the possibility of being recognized. The the Seoul Semiconductor main product AC power semiconductor light source ACRICHE Europe's most authoritative magazine Elektronik selected as the "Most Outstanding Product Award" in 2008 has also been granted by the Ministry of the knowledge-based economy "Technology Award of the Republic of Korea" and was looking forward to become a pilot and abroad light source market enterprises. 2008 total sales of 284.1 billion yuan, to ensure that more than 5,000 patents. Features including three local subsidiary 25 overseas sales offices, 114 distributors worldwide.
Seoul Semiconductor's main business is the production line of LED packaging and custom module products, including AC-driven semiconductor light source products, such as: Acriche, high-brightness high power LED, side light LED, top light LED, SMD LED, plug-in LED and Piranha (Super Light) LED. The products have been widely used in the scope of general lighting, display lighting, mobile phone backlight, TV, laptop computers, automotive lighting, household goods and traffic signals.
Technical advantages
1. by the light and the light-emitting composite, with "MODULE" technology;
2. with the "DIGITAL" circuit technology;
3. with the solution, including the blue light, white LED;
4. with the ultra-miniature, ultra-thin technology.
2008-2009 Enterprise
Seoul Semiconductor in 2008 sales of 264.1 billion won in 2007 to 184.626 billion, an increase of 43% of the company's sales and administrative expenses increased by 1.5 times, but R & D spending grew by 40% overall, EBIT and net profit were achieved in 2007 on the basis of a double.
British market research firm IMS Research report shows that in 2008, the total revenue of the global LED packaging products among the world's top three LED manufacturing enterprises are facing a strong challenge from Seoul, Korea Semiconductor, IMS Research company analysts believe In recent years, Seoul Semiconductor's growth rate is faster than the overall LED market, and have been steadily rising, Philips Lumileds may face in the next few years, the competition for the third largest LED supplier from Seoul Semiconductor.
In 2008, the company's expansion plans its fixed assets and equipment grew 41% capacity increase also led to a 65% increase in inventory. Seoul Semiconductor and Nichia patent disputes with each other to sign a cross-licensing agreement in February 2009, as the end, Seoul Semiconductor also silicate-based phosphor white LED patent cross-licensing agreement signed with LED Tridonic. Role in promoting the good news of the company's market capitalization. 2009, the company Acriche and Z-Power LED products in the U.S. and European markets professional praise.
6. Toyoda Gosei
Toyoda Gosei, headquartered in Aichi, Japan, the production of automobile parts and LEDLED revenue accounts for about 10%.
Toyoda Gosei and Toshiba jointly developed white LED UV LED and phosphor combination with general blue LED and phosphor combination of different ways. If the LED is likened to a car, then it can be said, Nichia Chemical propose the concept of the wheels and the engine, Toyoda Gosei proposed the concept of the body and tires. 1986, commissioned by the Honorary Professor Akasaki Mr. Toyoda Gosei own accumulation of membrane technology in the auto parts, LED R & D work to commence. 1987, development commissioned by the Science and Technology Corporation, Toyoda Gosei successfully formed on the sapphire LED electrode. Therefore, the Toyoda Gosei as "the vanguard of the blue LED is not an exaggeration. Toyoda Gosei is quite fast pace of development in the recent years. In 1998, its sales of 6.3 billion yen, but in 2002, has grown to 25.2 billion yen.
In 2003, due to the lack of phone white light source brightness, China, Taiwan and South Korea to take a low-cost strategy as well as the European display market downturn and many other reasons, resulting in Toyoda Gosei original plan to sell 34 billion yen task could not be completed, but its sales turnover and profits have reached the highest level in history. Which growth is a phone dedicated white LED, an increase of 12.3 billion yen from 2.7 billion yen in 2002, accounting for four percent of the total sales. The rest of the blue, blue-green the 3in1-white LED.2003 years, domestic sales accounted for 8 percent, to 23.7 billion yen. Overseas sales: 4.7 billion yen in Asia. In the application, the phone accounted for 72%. Addition, the the applications more LCD backlight button, the back of the LCD backlight (3in1). Signal equipment, large display applications.
In 2004, Toyoda Gosei's original plan to sell 42 billion yen, due to the downturn in the mobile phone market, and it had sales plan amendment for 30 billion yen. To attack wins Nichia Chemical occupy phone backlight market 90% of the market share, Toyota synthesis intent to improve white LED light brightness, in the fall of 2004 to develop the brightness to 1000mcd level of white LED "TGWHITE Ⅱ" This original 600-700mcd bright a lot. Then, Toyota compounds began developing 1300mcd white LED. Addition, car navigation systems and computers dedicated LCD controller, TV dedicated a large LCD backlight Toyota compounds target market. Lighting applications design and development are in full swing. The Toyota compounds production facilities in addition to the outside Aichi calm cho factory, still in Saga Prefecture Takeo City to establish a second production base production of blue LED GaNLED. Equipment investment amounted to 15.6 billion yen, the planned production reached 200 million in 2006 years. When the total production capacity of the two plants per month to 420 million, the 2008 LED sales of 120 billion yen.
7. Agilent (Agilent)
Agilent as the world's leading LED supplier, its products for the automotive, electronic information boards and traffic signal lights, industrial equipment, cellular phones, and consumer products to a large number of products to provide efficient, reliable light source. The high reliability of these components are usually guaranteed during the service life of the equipment do not have to replace the light source. Agilent's low-cost dot matrix LED display, variety of seven segment display and Agilent LED light, strip products have a variety of packages and colors to choose from. Agilent was first isolated from Hewlett-Packard. Hewlett-Packard Company in 1999 into two, her optoelectronics division was established as Agilent Technologies.
2013年2月19日星期二
Bomb Mushroom Cloud Shape LED Lamp
Since Japan 9 earthquake triggered a serious nuclear accident, the world is in intense discussion on nuclear power to go and stay in this stage no alternative green clean energy, nuclear energy remains a comprehensive comparison of the best choice LED lighting House believe that with the human development of civilization and technology, nuclear energy is safe and clean use of nuclear weapons atomic bomb had left the world of mass destruction, radiation, pollution will become a memory. Designer Luca Veneri design explosive shape table lamp, realistic mushroom cloud as it spread somersault in front of your eyes, to simulate the real scene when the explosion of the atomic bomb, the built-in LED table lamp emits bright light, like a nuclear bomb outbreak huge energy is energy saving and environmental protection new light source, is indeed very attractive attention to the room lighting to provide an interesting and thought-provoking lighting effects, of course, remember that LED lighting family friend, will be remembered taught you how to do at home, the atomic bomb mushroom cloud, you had better than this spectacular more to the force.
2013年1月28日星期一
An Introduction to Colour Changing RGB LED Tape
Colour Alteration RGB LED Band gives you the befalling to actualize colourful, capricious ambience, all at the blow of a button. It shares abounding of the aforementioned characteristics as its individual colour counterpart, including complete adaptability of design, bespoke acid options and a 3m cocky adhering backing. However, there are some notable differences which accomplish it a fully-interactive lighting experience.
First, there are the LED chips themselves. Unlike the LED chips on individual colour band lights, which are alone able of recreating a individual colour, colour alteration band appearance able RGB LED Chips, which are able to charm a advanced palette of colours.
The acumen for this is that anniversary of the RGB LED chips is not in fact a individual LED chip, but rather three chips accumulated into one. The belletrist "RGB" angle for Red, Blooming and Blue, and refers to the three primary colours that the LEDs alloy at their source. By bearing these three colours in differing quantites they are able to carbon a abundant beyond spectrum of colour.
The colour produced by anniversary LED is controlled by signals which are announced to anniversary of the three centralized LEDs, via the three (red, green, and blue) arresting affairs on the four amount cable acclimated by colour alteration LED Tape. These signals arise from an LED controller, which is in about-face controlled remotely, either through an infra red sensor or radio frequencies. The ambassador is an added assemblage which is installed amid the LED disciplinarian and band light.
Programming the LED Band is adequately aboveboard and is usually accomplished via a limited ascendancy supplied with the LED controller. As able-bodied as a ambit of changeless colour options, RGB band is aswell able of activating modes with capricious speeds and brightnesses.
If you are application an awfully ample accession you may crave the accession of an LED amplifier. These are advised to addition the arresting to the LED Band Lights by renewing the amplitude of the electrical accepted and should be installed wherever necessary.
Your all-embracing bureaucracy should abide of the afterward units:
- the colour alteration RGB LED Tape;
- an LED Ambassador (either RF or IR);
- an LED Disciplinarian (suitably sized);
- an amplifer(s) (if necessary).
RGB LED Tapes are currently acclimated in Lacoste food all beyond the UK area they add a ablution of colour to the high walls and ceilings. The aftereffect they aftermath is abundantly beautiful and acts as a absolute advertise for this able and activity able technology.
First, there are the LED chips themselves. Unlike the LED chips on individual colour band lights, which are alone able of recreating a individual colour, colour alteration band appearance able RGB LED Chips, which are able to charm a advanced palette of colours.
The acumen for this is that anniversary of the RGB LED chips is not in fact a individual LED chip, but rather three chips accumulated into one. The belletrist "RGB" angle for Red, Blooming and Blue, and refers to the three primary colours that the LEDs alloy at their source. By bearing these three colours in differing quantites they are able to carbon a abundant beyond spectrum of colour.
The colour produced by anniversary LED is controlled by signals which are announced to anniversary of the three centralized LEDs, via the three (red, green, and blue) arresting affairs on the four amount cable acclimated by colour alteration LED Tape. These signals arise from an LED controller, which is in about-face controlled remotely, either through an infra red sensor or radio frequencies. The ambassador is an added assemblage which is installed amid the LED disciplinarian and band light.
Programming the LED Band is adequately aboveboard and is usually accomplished via a limited ascendancy supplied with the LED controller. As able-bodied as a ambit of changeless colour options, RGB band is aswell able of activating modes with capricious speeds and brightnesses.
If you are application an awfully ample accession you may crave the accession of an LED amplifier. These are advised to addition the arresting to the LED Band Lights by renewing the amplitude of the electrical accepted and should be installed wherever necessary.
Your all-embracing bureaucracy should abide of the afterward units:
- the colour alteration RGB LED Tape;
- an LED Ambassador (either RF or IR);
- an LED Disciplinarian (suitably sized);
- an amplifer(s) (if necessary).
RGB LED Tapes are currently acclimated in Lacoste food all beyond the UK area they add a ablution of colour to the high walls and ceilings. The aftereffect they aftermath is abundantly beautiful and acts as a absolute advertise for this able and activity able technology.
2013年1月21日星期一
How to Improve White SMD Package Yields Can Effectively Reduce Production Costs
LED Engineering roundup with the package form of pluralistic development, more and more enterprises SMD LED package , competition is relatively intense. The raw materials used by the various companies in the industry are more or less the same, the difference is not gold wire , chip , glue, phosphor , such as stents, the prices are relatively transparent. Then, in the fierce competition in the market in order to earn a little small profit margins, key depends on "internal strength" shades of white light package engineers enterprises , the selection of raw materials and with particularly important.
About raw materials, the same batch of LED chips, and some corporate yield can only do 80% (20% of the BIN foreign goods), some companies are able to do 90% yield, the difference is very large, the yield of determines the level of increase or decrease of the final cost of the consignment. Many factors affect the yield, such as the viscosity of the silica gel and the particle size of the phosphor uniformity, etc. has a different effect, the viscosity is too low, the glue with the larger particles of the phosphor in the production process consistency is difficult to be controlled, prone to a lot of the BIN the outer product will increase the waste of raw materials to raise the overall cost of production. If the calculation of the total production costs (needed for the production of all raw materials costs and staff salaries, electricity and other costs), down this consignment production result is definitely a big loss. SMD3528 package, for example, if the yield is increased by 5%, the number of the yield and then do 1KK large cargo will increase to 50,000 lights in line with customer requirements, the market price of 50,000 lights total about 7000-10000 yuan or so. That is, if the yield in the production process has not been effectively improved, a loss of this value, thereby increasing the cost of production.
Improve white SMD yield in phosphor selection is very important, you need to select the phosphors suitable for SMD package dedicated , so with a the SMD package special glue to be able to make a perfect product. Imported phosphor prices and domestic phosphor price difference of nearly 1,000 yuan / 100 grams. Domestic phosphor cheap, but production and production yield is not high, from the price point of view of the surface to be able to reduce costs, in fact, ultimately increase the total cost of production, the above example illustrates this problem. Imported phosphor production technology is more mature and stable, is gaining the favor of the majority of white SMD manufacturers, such as Hongdae introduced H102, H132 (H102 is the upgraded version of the original old models of 00902, H132 is the original old models of 432 upgrade version), these two phosphor particle size 13um, particle size in the middle with moderate viscosity glue (such as: Shin-Etsu, 1018), coupled with strict control on made to improve the yield change very easy. If this calculated, to improve the yield of the phosphor Although a little expensive, but the cost of the entire process over to count, may still be imported phosphor lower cost, better for companies to create more profit margins.
Phosphor for phosphor for white engineers are misread. Not the larger particles phosphor the higher light efficiency, large phosphor particles requires a wavelength corresponding to large size blue chip excited to be able to play the best results. Larger phosphor particles suitable for high-power aspects of the package , because the high power LED corporate general monthly production capacity is not very high, the overall effect looks very different. SMD on different enterprises are generally put into operation on KK-class production, can only improve the yield increase its shipping rates to maximize profits.
About raw materials, the same batch of LED chips, and some corporate yield can only do 80% (20% of the BIN foreign goods), some companies are able to do 90% yield, the difference is very large, the yield of determines the level of increase or decrease of the final cost of the consignment. Many factors affect the yield, such as the viscosity of the silica gel and the particle size of the phosphor uniformity, etc. has a different effect, the viscosity is too low, the glue with the larger particles of the phosphor in the production process consistency is difficult to be controlled, prone to a lot of the BIN the outer product will increase the waste of raw materials to raise the overall cost of production. If the calculation of the total production costs (needed for the production of all raw materials costs and staff salaries, electricity and other costs), down this consignment production result is definitely a big loss. SMD3528 package, for example, if the yield is increased by 5%, the number of the yield and then do 1KK large cargo will increase to 50,000 lights in line with customer requirements, the market price of 50,000 lights total about 7000-10000 yuan or so. That is, if the yield in the production process has not been effectively improved, a loss of this value, thereby increasing the cost of production.
Improve white SMD yield in phosphor selection is very important, you need to select the phosphors suitable for SMD package dedicated , so with a the SMD package special glue to be able to make a perfect product. Imported phosphor prices and domestic phosphor price difference of nearly 1,000 yuan / 100 grams. Domestic phosphor cheap, but production and production yield is not high, from the price point of view of the surface to be able to reduce costs, in fact, ultimately increase the total cost of production, the above example illustrates this problem. Imported phosphor production technology is more mature and stable, is gaining the favor of the majority of white SMD manufacturers, such as Hongdae introduced H102, H132 (H102 is the upgraded version of the original old models of 00902, H132 is the original old models of 432 upgrade version), these two phosphor particle size 13um, particle size in the middle with moderate viscosity glue (such as: Shin-Etsu, 1018), coupled with strict control on made to improve the yield change very easy. If this calculated, to improve the yield of the phosphor Although a little expensive, but the cost of the entire process over to count, may still be imported phosphor lower cost, better for companies to create more profit margins.
Phosphor for phosphor for white engineers are misread. Not the larger particles phosphor the higher light efficiency, large phosphor particles requires a wavelength corresponding to large size blue chip excited to be able to play the best results. Larger phosphor particles suitable for high-power aspects of the package , because the high power LED corporate general monthly production capacity is not very high, the overall effect looks very different. SMD on different enterprises are generally put into operation on KK-class production, can only improve the yield increase its shipping rates to maximize profits.
2013年1月13日星期日
64 High-power Lighting-class LED Packaging Technology - 2
(2) Power LED combination of multi-chip package
The hexagonal aluminum substrate having a diameter of 3.175cm (1.25 inches), the light emitting region is located in its central portion, about 0.9525cm (0.375 inches) in diameter, which can accommodate 40 of the LED chip. The thermal liner, and the chip through bonding wires on a substrate made of the aluminum plate as the two points of contact with the positive electrode and the negative electrode connected. According to the size of the optical power of the desired output to determine the number of the substrate arranged on the die, the combination ultrahigh brightness chip package including AlGaInN and AlGaInP, they emitted light may be monochrome, color (RGB), white (RGB three primaries synthesis or by the blue and yellow binary synthesis). Finally, a high refractive index material to be encapsulated in accordance with the shape of the optical design, not only a high light extraction efficiency, but also to the chip and the bonding of the leads to be protected. 40 AlGaInP (AS) chip combo package LED luminous efficiency of 20lm / W. Using a combination of RGB three primary colors of synthetic white encapsulation module, when the mixing ratio of 0:43 (R) 0:48 (G): 0.009 (B) when a typical value for the luminous flux is 100lm, the the CCT standard color temperature is 4420K, the color coordinates x 0.3529 to 0.3612, y. This shows that this kind of power type LED the conventional chip for high-density combination package can reach a higher level of brightness with low thermal resistance, can work in the high-current and high optical output power.
Portfolio of multi-chip package high power LEDs, its structure and package more. The the American the UOE company in 2001 launched a portfolio of multi-chip package Norlux series LED, its structure is adopted the hexagonal aluminum plate as the substrate. Lanina Ceramics in 2003 to launch a low temperature co-fired ceramic (LTCC-M) technology package on the metal substrate using the company's proprietary high-power LED array. Panasonic introduced in 2003 high power white LED package 64 only chip combination. Nichia launched in 2003, the ultra-high brightness white LED luminous flux of up to 600lm output beam 1000lm, the power consumption of 30W, maximum input power of 50W up to 33lm / W luminous efficiency of white LED module. MB series of high-power LED characteristics of Taiwan UEC (the Guolian) company metal bonding (Metal Bonding) technology package, instead of using Si GaAs substrate, thermal effects, and as the light reflective layer to metal bonding layer to improve light output.
Power type LED thermal characteristics directly affect the LED's operating temperature, luminous efficiency, emission wavelength, life, power type LED chip package design, manufacturing technology is particularly important. The main issues to be considered in the high-power LED packaging:
(1) The cooling. Cooling is essential for power LED devices. If you can not dissipate the heat generated by the current in a timely manner to maintain the junction temperature of the PN junction within the allowable range, would not be able to obtain a stable light output and maintenance of the normal lifetime of the devices.
In the common heat sink material in the highest thermal conductivity of silver, but the high cost of silver, unsuitable for the universal type radiator. The thermal conductivity of copper is close to the silver, and its cost is lower than silver. Although the thermal conductivity of aluminum is lower than copper, but its lowest cost, is conducive to large-scale manufacturing.
After experimental comparison found a more appropriate approach is: connect the chip part of the copper-based or silver-based thermal liner, high thermal conductivity of the thermal liner connection aluminum radiator, ladder-type thermal structure, the use of copper or silver will efficient transfer of heat generated by the chip to the aluminum radiator, aluminum radiator to dissipate the heat (shed by air cooling or heat conduction). The advantages of this approach are: fully consider the value for money of the radiator, and together the different characteristics of the radiator, so that efficient cooling rationalization and cost control.
It should be noted that: the choice of material connected to the copper-based thermal liner with the chip is very important, the LED used in the chip-connecting material is silver glue. However, after a study found that the thermal resistance of the silver colloid is 10 ~ 25W / (m · K), if the use of silver gum as a connecting material, it is equal to artificially coupled with a thermal resistance between the chip and the thermal liner. Further, after curing of the silver plastic inner basic structure the epoxy skeleton + the amalgam fillings thermal conductive structure and a high thermal resistance of such a structure and lower TG point, extremely unfavorable for the stability of the cooling device and physical properties. Practice to solve this problem is: to tin plate welding as the material of the connection between the grain and the thermal liner [tin thermal conductivity of 67W / (m · K)], can be obtained an ideal thermal effects (thermal resistance of about 16 ℃ / W). Tin thermal effects and physical properties far superior to the silver plastic.
(2) the light. Conventional LED device package, only use the chip emits about 50% of the light, due to the refractive index of the semiconductor closed epoxy difference larger, resulting in the internal total reflection critical angle is small, the active layer generates light only small portion is removed, most of the light through multiple reflections inside the chip is absorbed, and this is the fundamental reason of the high brightness LED chip light extraction efficiency is very low. Between different materials of the internal refraction, reflection 50% of the consumed energy be utilized, is the design of the key of the optical coefficients.
Can be more effective than conventional LED chip packaging technology light exit through the chip's flip (Flip Chip) technology. If, however, it is to say in the light-emitting layer and the electrode of the chip below increases the reflective layer to reflect the light energy of a waste, will result in loss of about 8% of the light reflective layer, so the base plate material must be increased. The chip side surface of the light must also be used to heat the lining of the mirror machining method to be reflected, to increase the device out of the light-receiving rate. The optical combination of surface and in the portion of the sapphire substrate of the flip chip with the epoxy resin derivative should be added to a layer of silicone material, to improve the chip out of the refractive index of the light.
After the improvement of the optical packaging technology, can significantly improve the high-power LED devices the Idemitsu rate (flux). Lens optical design of the top of the high-power LED devices is also very important, the usual practice is: and during optical lens design should take full account of the the final lighting fixtures optical design requirements, as far as possible with the application of optical lighting equipment requirements for the design.
Common lens shape: convex lens, a concave cone lens, spherical lens, a Fresnel lens, and a combined lens. Lens with high-power LED devices ideal assembly method is to take a hermetic package, semi-hermetic package can also be taken, if the lens shape. The lens material should be selected high transmittance of synthetic materials such as glass or acrylic, and may also be used conventional epoxy modular package, together with the secondary thermal design which can achieve the effect to improve the light-receiving rate.
3. Power type LED progress
Power type LED development began in the mid-1960s, the GaAs infrared light source, because of its high reliability, small size, light weight, low voltage, first used in military night vision equipment, to replace the original Some incandescent 1980s InGaAsP / InP double heterojunction infrared light source is used for some special test equipment to replace the original volume, short life xenon lamp. This infrared light source DC operating current of up to 1A pulse current up to 24A. Infrared light source fall early power LED, but it has been developed so far, constantly upgrading products more widely, and become light power type LED technology base inheritable.
In 1991, red, orange, yellow the AlGaInP power type of LED practical application of LED from indoor to outdoor, successfully used in a variety of traffic lights, car tail lights, directional lights and outdoor information display. Blue, of green AlGaInN high brightness LED have developed successful, the realization of ultra-high brightness LED full color for lighting, however, is another new field of ultra-high brightness LED expansion, replace incandescent and fluorescent lamps with LED solid-state light LED Development Goals and other traditional glass bulb lighting source has become. Therefore, the power LED R & D and industrialization will become another important direction for future development, the key is to continuously improve the luminous efficiency of each device (component) luminous flux. Power type LED epitaxial material using an MOCVD epitaxial growth techniques and multiple quantum well structure, although the need to further improve the internal quantum efficiency, but the greatest obstacle to obtain a high luminous flux is still very low light extraction efficiency of the chip. Follows traditional indicator LED package structure, the operating current is generally limited to 20mA. According to this conventional concept design and production of power type LED simply can not achieve the requirements of high efficiency and high flux. In order to improve the visible power LED luminous efficiency and luminous flux, must adopt a new design concept, on the one hand, through the design of a new chip architecture to increase light extraction efficiency, on the other hand, by increasing the chip area, and increase the operating current, low thermal resistance The packaging structure to improve the photoelectric conversion efficiency of the device. Therefore, the design and production of the new chip and package structure, and continuously improve the light extraction efficiency of the device and photoelectric conversion efficiency has been a crucial issue in the development of power type LED.
Power type LED greatly expanding the application of LED in the signal display and the field of lighting source, automotive interior and exterior lights and traffic lights, including urban transport, railways, highways, airports, seaports, lighthouses, safety warning lights, etc.. Power white LED as special illumination source has started for the automotive and aircraft reading lights, portable lighting source (such as a key light, flashlight), backlight and miners lamps has also been an increasing number of applications. White addition of synthesized by the three primary colors, but also through a specially designed phosphor coated on the GaN blue or ultraviolet wavelength of the power-type LED chips are formed. Power type LED in building decorative lighting, stage lighting, store windows, lighting, advertising light boxes lighting, garden lawn lighting, city night scene compared to their similar products shows its unique characteristics. Use power type RGB tricolor LED, can be made into a compact structure, the tone light source of high luminous efficiency than traditional incandescent light source digital tune, with computer-controlled technology, can be obtained very colorful glow. Power type LED low voltage, low power consumption, small size, light weight, long life, high reliability, it can also serve as the military field, diving, aerospace, aviation, special solid light source.
Optimize the design of the progress of the power type LED structure, take the heat and light lining continuously improve its luminous efficiency and luminous flux from multiple 5mm LED lamp panel and lamp assembly will be replaced by power type LED assembly wick. From 1970 to 2000, the last 30 years, the luminous flux every 18 to 24 months to 2-fold increase. Since the advent of the 1998 Norlux Series Power LED, luminous flux increasing trend faster.
With the improvement of the performance of power type LED, LED lighting source has attracted greater attention in the field of lighting. General lighting market demand is huge, power white LED technology will be better able to adapt to the application of the general lighting. Sustainable development direction as long as the LED industry, LED solid-state lighting will be achieved in the next five to 10 years, a major breakthrough in the market.
The hexagonal aluminum substrate having a diameter of 3.175cm (1.25 inches), the light emitting region is located in its central portion, about 0.9525cm (0.375 inches) in diameter, which can accommodate 40 of the LED chip. The thermal liner, and the chip through bonding wires on a substrate made of the aluminum plate as the two points of contact with the positive electrode and the negative electrode connected. According to the size of the optical power of the desired output to determine the number of the substrate arranged on the die, the combination ultrahigh brightness chip package including AlGaInN and AlGaInP, they emitted light may be monochrome, color (RGB), white (RGB three primaries synthesis or by the blue and yellow binary synthesis). Finally, a high refractive index material to be encapsulated in accordance with the shape of the optical design, not only a high light extraction efficiency, but also to the chip and the bonding of the leads to be protected. 40 AlGaInP (AS) chip combo package LED luminous efficiency of 20lm / W. Using a combination of RGB three primary colors of synthetic white encapsulation module, when the mixing ratio of 0:43 (R) 0:48 (G): 0.009 (B) when a typical value for the luminous flux is 100lm, the the CCT standard color temperature is 4420K, the color coordinates x 0.3529 to 0.3612, y. This shows that this kind of power type LED the conventional chip for high-density combination package can reach a higher level of brightness with low thermal resistance, can work in the high-current and high optical output power.
Portfolio of multi-chip package high power LEDs, its structure and package more. The the American the UOE company in 2001 launched a portfolio of multi-chip package Norlux series LED, its structure is adopted the hexagonal aluminum plate as the substrate. Lanina Ceramics in 2003 to launch a low temperature co-fired ceramic (LTCC-M) technology package on the metal substrate using the company's proprietary high-power LED array. Panasonic introduced in 2003 high power white LED package 64 only chip combination. Nichia launched in 2003, the ultra-high brightness white LED luminous flux of up to 600lm output beam 1000lm, the power consumption of 30W, maximum input power of 50W up to 33lm / W luminous efficiency of white LED module. MB series of high-power LED characteristics of Taiwan UEC (the Guolian) company metal bonding (Metal Bonding) technology package, instead of using Si GaAs substrate, thermal effects, and as the light reflective layer to metal bonding layer to improve light output.
Power type LED thermal characteristics directly affect the LED's operating temperature, luminous efficiency, emission wavelength, life, power type LED chip package design, manufacturing technology is particularly important. The main issues to be considered in the high-power LED packaging:
(1) The cooling. Cooling is essential for power LED devices. If you can not dissipate the heat generated by the current in a timely manner to maintain the junction temperature of the PN junction within the allowable range, would not be able to obtain a stable light output and maintenance of the normal lifetime of the devices.
In the common heat sink material in the highest thermal conductivity of silver, but the high cost of silver, unsuitable for the universal type radiator. The thermal conductivity of copper is close to the silver, and its cost is lower than silver. Although the thermal conductivity of aluminum is lower than copper, but its lowest cost, is conducive to large-scale manufacturing.
After experimental comparison found a more appropriate approach is: connect the chip part of the copper-based or silver-based thermal liner, high thermal conductivity of the thermal liner connection aluminum radiator, ladder-type thermal structure, the use of copper or silver will efficient transfer of heat generated by the chip to the aluminum radiator, aluminum radiator to dissipate the heat (shed by air cooling or heat conduction). The advantages of this approach are: fully consider the value for money of the radiator, and together the different characteristics of the radiator, so that efficient cooling rationalization and cost control.
It should be noted that: the choice of material connected to the copper-based thermal liner with the chip is very important, the LED used in the chip-connecting material is silver glue. However, after a study found that the thermal resistance of the silver colloid is 10 ~ 25W / (m · K), if the use of silver gum as a connecting material, it is equal to artificially coupled with a thermal resistance between the chip and the thermal liner. Further, after curing of the silver plastic inner basic structure the epoxy skeleton + the amalgam fillings thermal conductive structure and a high thermal resistance of such a structure and lower TG point, extremely unfavorable for the stability of the cooling device and physical properties. Practice to solve this problem is: to tin plate welding as the material of the connection between the grain and the thermal liner [tin thermal conductivity of 67W / (m · K)], can be obtained an ideal thermal effects (thermal resistance of about 16 ℃ / W). Tin thermal effects and physical properties far superior to the silver plastic.
(2) the light. Conventional LED device package, only use the chip emits about 50% of the light, due to the refractive index of the semiconductor closed epoxy difference larger, resulting in the internal total reflection critical angle is small, the active layer generates light only small portion is removed, most of the light through multiple reflections inside the chip is absorbed, and this is the fundamental reason of the high brightness LED chip light extraction efficiency is very low. Between different materials of the internal refraction, reflection 50% of the consumed energy be utilized, is the design of the key of the optical coefficients.
Can be more effective than conventional LED chip packaging technology light exit through the chip's flip (Flip Chip) technology. If, however, it is to say in the light-emitting layer and the electrode of the chip below increases the reflective layer to reflect the light energy of a waste, will result in loss of about 8% of the light reflective layer, so the base plate material must be increased. The chip side surface of the light must also be used to heat the lining of the mirror machining method to be reflected, to increase the device out of the light-receiving rate. The optical combination of surface and in the portion of the sapphire substrate of the flip chip with the epoxy resin derivative should be added to a layer of silicone material, to improve the chip out of the refractive index of the light.
After the improvement of the optical packaging technology, can significantly improve the high-power LED devices the Idemitsu rate (flux). Lens optical design of the top of the high-power LED devices is also very important, the usual practice is: and during optical lens design should take full account of the the final lighting fixtures optical design requirements, as far as possible with the application of optical lighting equipment requirements for the design.
Common lens shape: convex lens, a concave cone lens, spherical lens, a Fresnel lens, and a combined lens. Lens with high-power LED devices ideal assembly method is to take a hermetic package, semi-hermetic package can also be taken, if the lens shape. The lens material should be selected high transmittance of synthetic materials such as glass or acrylic, and may also be used conventional epoxy modular package, together with the secondary thermal design which can achieve the effect to improve the light-receiving rate.
3. Power type LED progress
Power type LED development began in the mid-1960s, the GaAs infrared light source, because of its high reliability, small size, light weight, low voltage, first used in military night vision equipment, to replace the original Some incandescent 1980s InGaAsP / InP double heterojunction infrared light source is used for some special test equipment to replace the original volume, short life xenon lamp. This infrared light source DC operating current of up to 1A pulse current up to 24A. Infrared light source fall early power LED, but it has been developed so far, constantly upgrading products more widely, and become light power type LED technology base inheritable.
In 1991, red, orange, yellow the AlGaInP power type of LED practical application of LED from indoor to outdoor, successfully used in a variety of traffic lights, car tail lights, directional lights and outdoor information display. Blue, of green AlGaInN high brightness LED have developed successful, the realization of ultra-high brightness LED full color for lighting, however, is another new field of ultra-high brightness LED expansion, replace incandescent and fluorescent lamps with LED solid-state light LED Development Goals and other traditional glass bulb lighting source has become. Therefore, the power LED R & D and industrialization will become another important direction for future development, the key is to continuously improve the luminous efficiency of each device (component) luminous flux. Power type LED epitaxial material using an MOCVD epitaxial growth techniques and multiple quantum well structure, although the need to further improve the internal quantum efficiency, but the greatest obstacle to obtain a high luminous flux is still very low light extraction efficiency of the chip. Follows traditional indicator LED package structure, the operating current is generally limited to 20mA. According to this conventional concept design and production of power type LED simply can not achieve the requirements of high efficiency and high flux. In order to improve the visible power LED luminous efficiency and luminous flux, must adopt a new design concept, on the one hand, through the design of a new chip architecture to increase light extraction efficiency, on the other hand, by increasing the chip area, and increase the operating current, low thermal resistance The packaging structure to improve the photoelectric conversion efficiency of the device. Therefore, the design and production of the new chip and package structure, and continuously improve the light extraction efficiency of the device and photoelectric conversion efficiency has been a crucial issue in the development of power type LED.
Power type LED greatly expanding the application of LED in the signal display and the field of lighting source, automotive interior and exterior lights and traffic lights, including urban transport, railways, highways, airports, seaports, lighthouses, safety warning lights, etc.. Power white LED as special illumination source has started for the automotive and aircraft reading lights, portable lighting source (such as a key light, flashlight), backlight and miners lamps has also been an increasing number of applications. White addition of synthesized by the three primary colors, but also through a specially designed phosphor coated on the GaN blue or ultraviolet wavelength of the power-type LED chips are formed. Power type LED in building decorative lighting, stage lighting, store windows, lighting, advertising light boxes lighting, garden lawn lighting, city night scene compared to their similar products shows its unique characteristics. Use power type RGB tricolor LED, can be made into a compact structure, the tone light source of high luminous efficiency than traditional incandescent light source digital tune, with computer-controlled technology, can be obtained very colorful glow. Power type LED low voltage, low power consumption, small size, light weight, long life, high reliability, it can also serve as the military field, diving, aerospace, aviation, special solid light source.
Optimize the design of the progress of the power type LED structure, take the heat and light lining continuously improve its luminous efficiency and luminous flux from multiple 5mm LED lamp panel and lamp assembly will be replaced by power type LED assembly wick. From 1970 to 2000, the last 30 years, the luminous flux every 18 to 24 months to 2-fold increase. Since the advent of the 1998 Norlux Series Power LED, luminous flux increasing trend faster.
With the improvement of the performance of power type LED, LED lighting source has attracted greater attention in the field of lighting. General lighting market demand is huge, power white LED technology will be better able to adapt to the application of the general lighting. Sustainable development direction as long as the LED industry, LED solid-state lighting will be achieved in the next five to 10 years, a major breakthrough in the market.
64 High-power Lighting-class LED Packaging Technology - 1
From the point of view of practical application, installation is simple to use, the relatively small volume of high-power LED devices in most lighting applications will replace traditional power led devices. Small power LED lighting in order to meet the needs of the lighting, the focus must be on many LED light energy in order to meet the design requirements, but the drawback is that the line is very complex, poor heat dissipation, in order to balance the current between each LED voltage relationship, must be designed to the complexity of the power supply circuit. In contrast, the power of the high-power single LED is much larger than the number of small power LED the sum of the power supply line is relatively simple, perfect heat dissipation structure, physical properties and stability. So, packaging methods and packaging materials for high-power LED devices can not simply apply the traditional low-power LED devices and packaging methods and packaging materials. A new and higher requirements for large power dissipation, large heat and high light efficiency to LED packaging technology, packaging equipment and packaging materials.
1. High power LED chip
In order to get a high-power LED devices, it is necessary to prepare a suitable high-power LED chips. The usual method of manufacturing high power LED chip are summarized as follows:
(1) Increase the size of law. By increasing the effective light emitting area and size of single LED, prompting the current flowing through the TCL layers uniformly distributed, in order to achieve the desired luminous flux. However, simply increasing the light-emitting area can not solve the heat problem and the light problem, and not achieve the desired luminous flux and the practical application of the effect.
(2) Silicon backplane flip method. First preparing a large-size LED chip suitable for eutectic soldering, to simultaneously prepare the corresponding size of the silicon substrate and the silicon substrate to produce for eutectic soldering with a gold conductive layer and leads to the electrically conductive layer (Ultrasonic gold ball pads) , and then use the eutectic soldering device of the large-size LED chip and the silicon substrate are welded together. This structure is more reasonable, considering both the light problem, taking into account the heat problem, which is the current mainstream high power LED production.
American Lumileds, developed in 2001 AlGaInN power flip chip (FCLED) structure, the manufacturing process: First, the thickness of greater than 500A NiAu layer deposited on the top of the p-type GaN epitaxial wafers, used for ohmic contact and back reflector; then using a mask to select the P-type layer and multi-quantum well active layer is etched away, exposing the N-type layer; deposition, etching to form the N-type ohmic contact layer, a chip size of 1mm × 1mm, the P-type ohmic contact is square, N-type ohmic contact to comb inserted therein, so that the current extension distance can be shortened, the spreading resistance is minimized; then flip chip soldering metal bumps AlGaInN having anti-static protection diode (ESD) of the The silicon carrier.
(3) ceramic substrate flip. First use of the generic device of the LED chip having a suitable eutectic welding electrode structure of the large out of the light area of the LED chip and the corresponding ceramic base plate was prepared, and on the ceramic substrate produced a eutectic soldering conductive layer and leads to the conductive layer, and then using eutectic soldering The equipment will be large-size LED chip and the ceramic substrate are welded together. This structure not only consider the light problems also take into account the heat problem, and ceramic floor for high thermal conductivity ceramic plates, the cooling effect is very ideal, the price is relatively low, so for more suitable substrate material, and may in the future IC integration package reserved space.
(4) sapphire substrate transition method. InGaN chip in accordance with the traditional method of manufacturing a PN junction is grown on a sapphire substrate, sapphire substrate removal, and then connect to the traditional four-membered, material and manufacture of the large size of the blue LED chip of the upper and lower electrode structures.
(5) The AlGaInN silicon carbide (SiC) on the back light method. Cree Inc., USA is the world's only SiC substrate manufacturing AlGaInN high brightness LED manufacturers, the past few years its production AlGaInN / SiCa chip structure continue to improve brightness and continuously improve. As the P-type and N-type electrode, respectively, located in the bottom and top of the chip, the use of single-wire bonding, better compatibility, ease of use, and thus become another mainstream products of the the AlGaInN LED development.
2. The power-type package
Power LED was first started in the HP "piranhas" package LED structure introduced in the early 1990s, launched the company in 1994 improved "Snap LED" There are two operating current of 70mA and 150mA, input power up to 0.3W. The power LED input power than the original bracket encapsulated LED input power is increased several times, thermal resistance is reduced fraction of the original. W-class power LEDs is a core part of the future of lighting devices, so the world's major companies have invested a great deal of effort watt-level power LED packaging technology research and development.
LED chip and packaging to the direction of the high-power development, large current is 10 to 20 times more than φ5mm LED luminous flux, we must solve the problem of bad light, effective heat dissipation without deterioration of the packaging materials, shell and tube, and the package is its The key technologies, be able to withstand a few watts of power LED packaging. 5W series of white, green, blue-green, blue power LED from early 2003 to market, white LED light output of 187lm luminous efficiency for 44.3lm / W. Developed can withstand 10W power LED, the use of a large area of the die size of 2.5mm × 2.5 mm in 5A current, light output up to 200lm.
LUXEON series power LED the AlGaInN power-type flip-die flip chip bonding with solder bumps on the silicon carrier, and then the completion of the flip chip bonding silicon carrier loaded in the thermal liner and the shell, the bonding wires to be encapsulated. This encapsulation of the light extraction efficiency, thermal properties, and are designed to increase the operating current density.
In the application, can be encapsulated product assembly in a metal core PCB, with aluminum interlayer, forming power density type LED PCB board as the wiring of the device electrodes is connected to use, the aluminum sandwich can be used as a thermal liner to to obtain a higher luminous flux and photoelectric conversion efficiency. In addition, the encapsulated SMD LED very small, and can be flexibly combined, constitute a module type light guide plate-type condenser type, reflective type colorful lighting source.
High brightness LED lights and other auxiliary lighting source applications, generally the multiple Φ5mm package a variety of monochrome and white LED assembly on a lamp panel or standard lamp holder, life can reach 100,000 hours. 2000 studies have pointed out the white LED work 6000h in Φ5mm, its intensity has been reduced to half its original. In fact, the use of Φ5mm white LED array light-emitting device, its life may be 5000h. Different color LED light attenuation at different speeds, the slowest which red, blue, green center, white fastest. Used only for indicator LED original Φ5mm package, package thermal resistance up to 300 ° C / W, can not be fully heat dissipation, resulting in elevated temperature of the LED chip, causing the devices optical attenuator accelerated. In addition, the epoxy yellowing will reduce the light output. High Power LED generated in the high current white LED is 10 to 20 times more luminous flux than Φ5mm effective thermal design and the use of packaging material does not deteriorate to solve the problem of bad light, shell and tube, and the package has become the development of high-power LED one of the key technologies. New LED power-type packaging design concept mainly grouped into two categories, a class of single-chip power package, and the other for multi-chip power package.
(1) Single-chip power type LED package
1998 American Lumileds developed Luxeon high-power LED series single-chip package structure, this power single-chip LED package structure with conventional Φ5mm LED package structure is completely different, it is a positive light LED chip soldered directly to the thermal liner The LED chip, or on the back of light first flip-chip having solder bumps on the silicon carrier, and then welding on the thermal liner, so that large area chips in the large current, the thermal characteristics of the work is improved. This package light extraction efficiency, thermal performance and current density of the design are the best, its main features are:
A. Low thermal resistance. The conventional epoxy Packaging has high thermal resistance, and thermal resistance of this new structure of a package is typically only 14 ° C / W, can be reduced to 1/20 of the conventional LED.
B. High reliability. Filled inside a stable, flexible gel, at 40 to 120 ° C, the internal stress generated due to sudden changes in temperature will not make the gold and the frame lead is disconnected. With this silicone rubber as the sealing material of the optical coupling, does not appear as yellowing of ordinary optical epoxy, the metal lead frame is also not due to oxidation and dirt.
C. Reflector cup and lens design so that the radiation controlled, the highest optical efficiency. In applications they can be assembled in one with aluminum interlayer circuit board (aluminum PCB) on the circuit board as the wiring of the device electrodes is connected with the the aluminum sandwich can be as a power type LED thermal liner. So that not only a high luminous flux can be obtained, but also has a high photoelectric conversion efficiency.
Single-chip W-class power LED was first introduced in 1998 by Lumileds Luxeon LED, the characteristics of the package structure thermoelectric form of separation, the flip-chip silicon carrier is soldered directly to the thermal liner and reflective cup optical lens and a flexible transparent plastic new structures and new materials, high-power single-chip 1W, 3W and 5W LED products are available now. OSRAM 2003 Golden Dragon series of single-chip LED, its structure is characterized by a thermal liner is in direct contact with the metal circuit board has good heat dissipation, input power up to 1W.
1. High power LED chip
In order to get a high-power LED devices, it is necessary to prepare a suitable high-power LED chips. The usual method of manufacturing high power LED chip are summarized as follows:
(1) Increase the size of law. By increasing the effective light emitting area and size of single LED, prompting the current flowing through the TCL layers uniformly distributed, in order to achieve the desired luminous flux. However, simply increasing the light-emitting area can not solve the heat problem and the light problem, and not achieve the desired luminous flux and the practical application of the effect.
(2) Silicon backplane flip method. First preparing a large-size LED chip suitable for eutectic soldering, to simultaneously prepare the corresponding size of the silicon substrate and the silicon substrate to produce for eutectic soldering with a gold conductive layer and leads to the electrically conductive layer (Ultrasonic gold ball pads) , and then use the eutectic soldering device of the large-size LED chip and the silicon substrate are welded together. This structure is more reasonable, considering both the light problem, taking into account the heat problem, which is the current mainstream high power LED production.
American Lumileds, developed in 2001 AlGaInN power flip chip (FCLED) structure, the manufacturing process: First, the thickness of greater than 500A NiAu layer deposited on the top of the p-type GaN epitaxial wafers, used for ohmic contact and back reflector; then using a mask to select the P-type layer and multi-quantum well active layer is etched away, exposing the N-type layer; deposition, etching to form the N-type ohmic contact layer, a chip size of 1mm × 1mm, the P-type ohmic contact is square, N-type ohmic contact to comb inserted therein, so that the current extension distance can be shortened, the spreading resistance is minimized; then flip chip soldering metal bumps AlGaInN having anti-static protection diode (ESD) of the The silicon carrier.
(3) ceramic substrate flip. First use of the generic device of the LED chip having a suitable eutectic welding electrode structure of the large out of the light area of the LED chip and the corresponding ceramic base plate was prepared, and on the ceramic substrate produced a eutectic soldering conductive layer and leads to the conductive layer, and then using eutectic soldering The equipment will be large-size LED chip and the ceramic substrate are welded together. This structure not only consider the light problems also take into account the heat problem, and ceramic floor for high thermal conductivity ceramic plates, the cooling effect is very ideal, the price is relatively low, so for more suitable substrate material, and may in the future IC integration package reserved space.
(4) sapphire substrate transition method. InGaN chip in accordance with the traditional method of manufacturing a PN junction is grown on a sapphire substrate, sapphire substrate removal, and then connect to the traditional four-membered, material and manufacture of the large size of the blue LED chip of the upper and lower electrode structures.
(5) The AlGaInN silicon carbide (SiC) on the back light method. Cree Inc., USA is the world's only SiC substrate manufacturing AlGaInN high brightness LED manufacturers, the past few years its production AlGaInN / SiCa chip structure continue to improve brightness and continuously improve. As the P-type and N-type electrode, respectively, located in the bottom and top of the chip, the use of single-wire bonding, better compatibility, ease of use, and thus become another mainstream products of the the AlGaInN LED development.
2. The power-type package
Power LED was first started in the HP "piranhas" package LED structure introduced in the early 1990s, launched the company in 1994 improved "Snap LED" There are two operating current of 70mA and 150mA, input power up to 0.3W. The power LED input power than the original bracket encapsulated LED input power is increased several times, thermal resistance is reduced fraction of the original. W-class power LEDs is a core part of the future of lighting devices, so the world's major companies have invested a great deal of effort watt-level power LED packaging technology research and development.
LED chip and packaging to the direction of the high-power development, large current is 10 to 20 times more than φ5mm LED luminous flux, we must solve the problem of bad light, effective heat dissipation without deterioration of the packaging materials, shell and tube, and the package is its The key technologies, be able to withstand a few watts of power LED packaging. 5W series of white, green, blue-green, blue power LED from early 2003 to market, white LED light output of 187lm luminous efficiency for 44.3lm / W. Developed can withstand 10W power LED, the use of a large area of the die size of 2.5mm × 2.5 mm in 5A current, light output up to 200lm.
LUXEON series power LED the AlGaInN power-type flip-die flip chip bonding with solder bumps on the silicon carrier, and then the completion of the flip chip bonding silicon carrier loaded in the thermal liner and the shell, the bonding wires to be encapsulated. This encapsulation of the light extraction efficiency, thermal properties, and are designed to increase the operating current density.
In the application, can be encapsulated product assembly in a metal core PCB, with aluminum interlayer, forming power density type LED PCB board as the wiring of the device electrodes is connected to use, the aluminum sandwich can be used as a thermal liner to to obtain a higher luminous flux and photoelectric conversion efficiency. In addition, the encapsulated SMD LED very small, and can be flexibly combined, constitute a module type light guide plate-type condenser type, reflective type colorful lighting source.
High brightness LED lights and other auxiliary lighting source applications, generally the multiple Φ5mm package a variety of monochrome and white LED assembly on a lamp panel or standard lamp holder, life can reach 100,000 hours. 2000 studies have pointed out the white LED work 6000h in Φ5mm, its intensity has been reduced to half its original. In fact, the use of Φ5mm white LED array light-emitting device, its life may be 5000h. Different color LED light attenuation at different speeds, the slowest which red, blue, green center, white fastest. Used only for indicator LED original Φ5mm package, package thermal resistance up to 300 ° C / W, can not be fully heat dissipation, resulting in elevated temperature of the LED chip, causing the devices optical attenuator accelerated. In addition, the epoxy yellowing will reduce the light output. High Power LED generated in the high current white LED is 10 to 20 times more luminous flux than Φ5mm effective thermal design and the use of packaging material does not deteriorate to solve the problem of bad light, shell and tube, and the package has become the development of high-power LED one of the key technologies. New LED power-type packaging design concept mainly grouped into two categories, a class of single-chip power package, and the other for multi-chip power package.
(1) Single-chip power type LED package
1998 American Lumileds developed Luxeon high-power LED series single-chip package structure, this power single-chip LED package structure with conventional Φ5mm LED package structure is completely different, it is a positive light LED chip soldered directly to the thermal liner The LED chip, or on the back of light first flip-chip having solder bumps on the silicon carrier, and then welding on the thermal liner, so that large area chips in the large current, the thermal characteristics of the work is improved. This package light extraction efficiency, thermal performance and current density of the design are the best, its main features are:
A. Low thermal resistance. The conventional epoxy Packaging has high thermal resistance, and thermal resistance of this new structure of a package is typically only 14 ° C / W, can be reduced to 1/20 of the conventional LED.
B. High reliability. Filled inside a stable, flexible gel, at 40 to 120 ° C, the internal stress generated due to sudden changes in temperature will not make the gold and the frame lead is disconnected. With this silicone rubber as the sealing material of the optical coupling, does not appear as yellowing of ordinary optical epoxy, the metal lead frame is also not due to oxidation and dirt.
C. Reflector cup and lens design so that the radiation controlled, the highest optical efficiency. In applications they can be assembled in one with aluminum interlayer circuit board (aluminum PCB) on the circuit board as the wiring of the device electrodes is connected with the the aluminum sandwich can be as a power type LED thermal liner. So that not only a high luminous flux can be obtained, but also has a high photoelectric conversion efficiency.
Single-chip W-class power LED was first introduced in 1998 by Lumileds Luxeon LED, the characteristics of the package structure thermoelectric form of separation, the flip-chip silicon carrier is soldered directly to the thermal liner and reflective cup optical lens and a flexible transparent plastic new structures and new materials, high-power single-chip 1W, 3W and 5W LED products are available now. OSRAM 2003 Golden Dragon series of single-chip LED, its structure is characterized by a thermal liner is in direct contact with the metal circuit board has good heat dissipation, input power up to 1W.
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